Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9099296 | Stacked microelectronic assembly with TSVS formed in stages with plural active chips | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2015-08-04 |
| 9099479 | Carrier structures for microelectronic elements | Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed | 2015-08-04 |
| 9041133 | BSI image sensor package with embedded absorber for even reception of different wavelengths | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2015-05-26 |
| 9018769 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2015-04-28 |
| 8975751 | Vias in porous substrates | Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh | 2015-03-10 |
| 8956916 | Multi-chip module with stacked face-down connected dies | Belgacem Haba, Ilyas Mohammed | 2015-02-17 |
| 8937361 | BSI image sensor package with variable-height silicon for even reception of different wavelengths | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2015-01-20 |
| 8847380 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-09-30 |
| 8847376 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed | 2014-09-30 |
| 8841763 | Three-dimensional system-in-a-package | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-09-23 |
| 8841765 | Multi-chip module with stacked face-down connected dies | Belgacem Haba, Ilyas Mohammed | 2014-09-23 |
| 8835223 | Chip assembly having via interconnects joined by plating | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-09-16 |
| 8809190 | Multi-function and shielded 3D interconnects | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-08-19 |
| 8796135 | Microelectronic elements with rear contacts connected with via first or via middle structures | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-08-05 |
| 8796828 | Compliant interconnects in wafers | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-08-05 |
| 8791575 | Microelectronic elements having metallic pads overlying vias | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba | 2014-07-29 |
| 8742541 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh, Vage Oganesian | 2014-06-03 |
| 8736066 | Stacked microelectronic assemby with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-05-27 |
| 8709913 | Simultaneous wafer bonding and interconnect joining | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-04-29 |
| 8697569 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-04-15 |
| 8685793 | Chip assembly having via interconnects joined by plating | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-04-01 |
| 8686565 | Stacked chip assembly having vertical vias | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2014-04-01 |
| 8652935 | Void-free wafer bonding using channels | Ilyas Mohammed, Craig Mitchell, Vage Oganesian, Belgacem Haba | 2014-02-18 |
| 8637968 | Stacked microelectronic assembly having interposer connecting active chips | Belgacem Haba, Vage Oganesian, Ilyas Mohammed, Craig Mitchell | 2014-01-28 |
| 8610264 | Compliant interconnects in wafers | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell | 2013-12-17 |