Issued Patents All Time
Showing 26–50 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659812 | Microelectronic elements with post-assembly planarization | Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2017-05-23 |
| 9640437 | Methods of forming semiconductor elements using micro-abrasive particle stream | Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia | 2017-05-02 |
| 9620437 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2017-04-11 |
| 9570634 | Sensor package with exposed sensor array and method of making same | Zhenhua Lu | 2017-02-14 |
| 9560773 | Electrical barrier layers | Cyprian Emeka Uzoh, Ilyas Mohammed, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2017-01-31 |
| 9558998 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Ilyas Mohammed | 2017-01-31 |
| 9548254 | Packaged semiconductor chips with array | Andrey Grinman, David Ovrutsky, Charles Rosenstein | 2017-01-17 |
| 9543347 | Stress released image sensor package structure and method | Zhenhua Lu | 2017-01-10 |
| 9524917 | Chip level heat dissipation using silicon | — | 2016-12-20 |
| 9496247 | Integrated camera module and method of making same | Zhenhua Lu | 2016-11-15 |
| 9496297 | Sensor package with cooling feature and method of making same | Zhenhua Lu | 2016-11-15 |
| 9461190 | Low profile sensor package with cooling feature and method of making same | Zhenhua Lu | 2016-10-04 |
| 9437557 | High density three-dimensional integrated capacitors | Ilyas Mohammed, Belgacem Haba, Cyprian Emeka Uzoh, Piyush Savalia | 2016-09-06 |
| 9431475 | High density three-dimensional integrated capacitors | Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2016-08-30 |
| 9378967 | Method of making a stacked microelectronic package | Belgacem Haba | 2016-06-28 |
| 9373660 | Method of forming a low profile image sensor package with an image sensor substrate, a support substrate and a printed circuit board | — | 2016-06-21 |
| 9373653 | Stepped package for image sensor | — | 2016-06-21 |
| 9368476 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-06-14 |
| 9362203 | Staged via formation from both sides of chip | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-06-07 |
| 9355959 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Ilyas Mohammed, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2016-05-31 |
| 9355948 | Multi-function and shielded 3D interconnects | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-05-31 |
| 9355901 | Non-lithographic formation of three-dimensional conductive elements | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-05-31 |
| 9318385 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Ilyas Mohammed | 2016-04-19 |
| 9287164 | Single exposure in multi-damascene process | Cyprian Emeka Uzoh, Ilyas Mohammed, Craig Mitchell, Belgacem Haba | 2016-03-15 |
| 9269692 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia | 2016-02-23 |