Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7936062 | Wafer level chip packaging | Giles Humpston, Michael J. Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian +7 more | 2011-05-03 |
| 7224056 | Back-face and edge interconnects for lidded package | Belgacem Haba, Giles Humpston, David B. Tuckerman, Michael Warner, Craig Mitchell | 2007-05-29 |