Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5749988 | Reworkable die attachment to heat spreader | Jacques Leibovitz, Peter F. Dawson, Greg M. Irby | 1998-05-12 |
| 5621615 | Low cost, high thermal performance package for flip chips with low mechanical stress on chip | Peter F. Dawson, Jacques Leibovitz | 1997-04-15 |
| 5585671 | Reliable low thermal resistance package for high power flip clip ICs | Kim Hong Chen, Cheng-Cheng Chang, Bahram Afshari, Jacques Leibovitz | 1996-12-17 |
| 5484964 | Surface mounting pin grid arrays | Peter F. Dawson, by Shirley B. Dawson, executor, Jacques Leibovitz | 1996-01-16 |
| 5409157 | Composite transversely plastic interconnect for microchip carrier | Daniel J. Miller, Robert A. Schuchard, Jeffrey G. Hargis | 1995-04-25 |
| 5324569 | Composite transversely plastic interconnect for microchip carrier | Daniel J. Miller, Robert A. Schuchard, Jeffrey G. Hargis | 1994-06-28 |
| 5268048 | Reworkable die attachment | Jacques Leibovitz, Hilmar W. Spieth, Peter F. Dawson | 1993-12-07 |
| 5221421 | Controlled etching process for forming fine-geometry circuit lines on a substrate | Jacques Leibovitz, Daniel J. Miller, Maria L. Cobarruviaz, John P. Scalia, Howard H. Nakano +1 more | 1993-06-22 |
| 5155661 | Aluminum nitride multi-chip module | Kim Hong Chen | 1992-10-13 |
| 5113314 | High-speed, high-density chip mounting | Richard L. Wheeler | 1992-05-12 |