Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9391833 | Fault signaling for ethernet | Roman Krzanowski, Michael U. Bencheck, Vincent Alesi, Virgil Vladescu | 2016-07-12 |
| 8743559 | Interconnect pattern for semiconductor packaging | Paul Ying-Fung Wu | 2014-06-03 |
| 8395903 | Interconnect pattern for semiconductor packaging | Paul Ying-Fung Wu | 2013-03-12 |
| 8386229 | Integrated circuit package component and ball grid array simulation model | Raymond E. Anderson, Sanjay Mehta | 2013-02-26 |
| 7372627 | Holder for field glasses | — | 2008-05-13 |
| 6871290 | Method for reducing a magnitude of a rate of current change of an integrated circuit | Claude Gauthier, Tyler Thorp, Brian Amick | 2005-03-22 |
| 6754616 | Method of emulating an ideal transformer valid from DC to infinite frequency | Bidyut Sen, James C. Parker | 2004-06-22 |
| 6483341 | CMOS-microprocessor chip and package anti-resonance apparatus | Claude Gauthier, Tyler Thorp, Brian Amick | 2002-11-19 |
| 6456107 | CMOS-microprocessor chip and package anti-resonance method | Claude Gauthier, Tyler Thorp, Brian Amick | 2002-09-24 |
| 6441640 | CMOS-microprocessor chip and package anti-resonance pass-band shunt apparatus | Claude Gauthier, Brian Amick, Tyler Thorp | 2002-08-27 |
| 6034332 | Power supply distribution structure for integrated circuit chip modules | Larry L. Moresco, Solomon I. Beilin, David A. Horine | 2000-03-07 |
| 6025647 | Apparatus for equalizing signal parameters in flip chip redistribution layers | Jayarama N. Shenoy | 2000-02-15 |
| 5817533 | High-yield methods of fabricating large substrate capacitors | Bidyut Sen, Michael G. Peters, Wen-chou Vincent Wang | 1998-10-06 |
| 5765279 | Methods of manufacturing power supply distribution structures for multichip modules | Larry L. Moresco, Solomon I. Beilin, David A. Horine | 1998-06-16 |
| 5701071 | Systems for controlling power consumption in integrated circuits | Jiunn-Yau Liou, Bidyut Sen, James C. Parker | 1997-12-23 |
| 5652693 | Substrate with thin film capacitor and insulating plug | William T. Chou, Michael G. Peters, Wen-chou Vincent Wang | 1997-07-29 |
| 5514906 | Apparatus for cooling semiconductor chips in multichip modules | David G. Love, Larry L. Moresco, David A. Horine, Wen-chou Vincent Wang, Patricia R. Boucher +1 more | 1996-05-07 |
| 5508938 | Special interconnect layer employing offset trace layout for advanced multi-chip module packages | — | 1996-04-16 |
| 5455064 | Process for fabricating a substrate with thin film capacitor and insulating plug | William T. Chou, Michael G. Peters, Wen-chou Vincent Wang | 1995-10-03 |
| 5113314 | High-speed, high-density chip mounting | Voddarahalli K. Nagesh | 1992-05-12 |
| 4987322 | Driver-receiver pair for low noise digital signaling | — | 1991-01-22 |