Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679954 | Integrated circuit system with carrier construction configuration and method of manufacture thereof | Philip Eugene Rogren | 2020-06-09 |
| 8116097 | Apparatus for electrically coupling a semiconductor package to a printed circuit board | Bidyut Sen | 2012-02-14 |
| 7754343 | Ternary alloy column grid array | Bidyut Sen | 2010-07-13 |
| 6317326 | Integrated circuit device package and heat dissipation device | Marlin R. Vogel | 2001-11-13 |
| 6168971 | Method of assembling thin film jumper connectors to a substrate | Patricia R. Boucher, David A. Horine | 2001-01-02 |
| 6126059 | Captured-cell solder printing and reflow methods and apparatuses | John MacKay, Thomas E. Molinaro, Patricia R. Boucher | 2000-10-03 |
| 5988487 | Captured-cell solder printing and reflow methods | John MacKay, Thomas E. Molinaro, Patricia R. Boucher | 1999-11-23 |
| 5897341 | Diffusion bonded interconnect | Larry L. Moresco | 1999-04-27 |
| 5773889 | Wire interconnect structures for connecting an integrated circuit to a substrate | Larry L. Moresco, William T. Chou, David A. Horine, Connie M. Wong, Solomon I. Beilin | 1998-06-30 |
| 5597412 | Apparatus for forcing plating solution into via openings | Carlo Grilletto | 1997-01-28 |
| 5536362 | Wire interconnect structures for connecting an integrated circuit to a substrate | Larry L. Moresco, William T. Chou, David A. Horine, Connie M. Wong, Solomon I. Beilin | 1996-07-16 |
| 5515604 | Methods for making high-density/long-via laminated connectors | David A. Horine | 1996-05-14 |
| 5514906 | Apparatus for cooling semiconductor chips in multichip modules | Larry L. Moresco, David A. Horine, Wen-chou Vincent Wang, Richard L. Wheeler, Patricia R. Boucher +1 more | 1996-05-07 |
| 5477160 | Module test card | — | 1995-12-19 |
| 5404265 | Interconnect capacitors | Larry L. Moresco, Wen-chou Vincent Wang | 1995-04-04 |
| 5363038 | Method and apparatus for testing an unpopulated chip carrier using a module test card | — | 1994-11-08 |
| 5334804 | Wire interconnect structures for connecting an integrated circuit to a substrate | Larry L. Moresco, William T. Chou, David A. Horine, Connie M. Wong, Solomon I. Beilin | 1994-08-02 |