Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6866741 | Method for joining large substrates | Albert W. Chan, Michael G. Lee, Mark Thomas McCormack | 2005-03-15 |
| 6845184 | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William T. Chou +3 more | 2005-01-18 |
| 6785447 | Single and multilayer waveguides and fabrication process | Tetsuzo Yoshimura, Yasuhito Takahashi, James J. Roman, Wen-chou Vincent Wang, Masaaki Inao | 2004-08-31 |
| 6733685 | Methods of planarizing structures on wafers and substrates by polishing | Michael G. Lee, William T. Chou, Larry L. Moresco, Wen-chou Vincent Wang | 2004-05-11 |
| 6706546 | Optical reflective structures and method for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Kiyoshi Kuwabara, Michael G. Peters, Wen-chou Vincent Wang +1 more | 2004-03-16 |
| 6690845 | Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William T. Chou +3 more | 2004-02-10 |
| 6684007 | Optical coupling structures and the fabrication processes | Tetsuzo Yoshimura, Yasuhito Takahashi, James J. Roman, Mark Thomas McCormack, Wen-chou Vincent Wang +1 more | 2004-01-27 |
| 6662443 | Method of fabricating a substrate with a via connection | William T. Chou, Michael G. Lee, Michael G. Peters, Wen-chou Vincent Wang | 2003-12-16 |
| 6611635 | Opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William T. Chou +3 more | 2003-08-26 |
| 6579474 | Conductive composition | Mark Thomas McCormack, Hunt Hang Jiang, Albert W. Chan, Yasuhito Takahashi | 2003-06-17 |
| 6572780 | Methods for fabricating flexible circuit structures | Mark Thomas McCormack, James J. Roman, Lei Zhang | 2003-06-03 |
| 6544430 | Methods for detaching a layer from a substrate | Mark Thomas McCormack, James J. Roman, Lei Zhang | 2003-04-08 |
| 6509529 | Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch | Sundar M. Kamath, David Chazan, Jan Strandberg | 2003-01-21 |
| 6444921 | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like | Wen-chou Vincent Wang, Michael G. Lee | 2002-09-03 |
| 6391220 | Methods for fabricating flexible circuit structures | Lei Zhang, Som S. Swamy, James J. Roman | 2002-05-21 |
| 6343171 | Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William T. Chou +3 more | 2002-01-29 |
| 6326555 | Method and structure of z-connected laminated substrate for high density electronic packaging | Mark Thomas McCormack, Hunt Hang Jiang, Thomas J. Massingill | 2001-12-04 |
| 6317331 | Wiring substrate with thermal insert | Sundar M. Kamath, David Chazan | 2001-11-13 |
| 6299053 | Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch | Sundar M. Kamath, David Chazan, Jan Strandberg | 2001-10-09 |
| 6281040 | Methods for making circuit substrates and electrical assemblies | Mark Thomas McCormack, Hunt Hang Jiang, Albert W. Chan, Yasuhito Takahashi | 2001-08-28 |
| 6239485 | Reduced cross-talk noise high density signal interposer with power and ground wrap | Michael G. Peters, Wen-chou Vincent Wang, Yasuhito Takahashi, William T. Chou, Michael G. Lee | 2001-05-29 |
| 6226171 | Power conducting substrates with high-yield integrated substrate capacitor | William T. Chou, Michael G. Lee, David D. Ngo, Michael G. Peters, James J. Roman +1 more | 2001-05-01 |
| 6221567 | Method of patterning polyamic acid layers | William T. Chou, David D. Ngo | 2001-04-24 |
| 6187652 | Method of fabrication of multiple-layer high density substrate | William T. Chou, Michael G. Lee, Michael G. Peters, Wen-chou Vincent Wang | 2001-02-13 |
| 6146241 | Apparatus for uniform chemical mechanical polishing by intermittent lifting and reversible rotation | Michael G. Lee | 2000-11-14 |