Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8800142 | Package substrate unit and method for manufacturing package substrate unit | Hnin Nway San Nang, Kazuya Arai, Kei Fukui, Shinpei Ikegami, Hideaki Yoshimura +1 more | 2014-08-12 |
| 8231726 | Semiconductor light emitting element, group III nitride semiconductor substrate and method for manufacturing such group III nitride semiconductor substrate | Hisashi Minemoto, Yasuo Kitaoka, Yasutoshi Kawaguchi, Yoshiaki Hasegawa | 2012-07-31 |
| 7855823 | Acoustooptic device and optical imaging apparatus using the same | Hisashi Minemoto, Yasuo Kitaoka, Isao Kidoguchi, Takayuki Negami, Toshimi Nishiyama +1 more | 2010-12-21 |
| 7794539 | Method for producing III group element nitride crystal, production apparatus for use therein, and semiconductor element produced thereby | Hisashi Minemoto, Yasuo Kitaoka, Isao Kidoguchi, Yusuke Mori, Fumio Kawamura +1 more | 2010-09-14 |
| 7754012 | Apparatus for production of crystal of group III element nitride and process for producing crystal of group III element nitride | Hisashi Minemoto, Yasuo Kitaoka, Isao Kidoguchi, Yusuke Mori, Fumio Kawamura +2 more | 2010-07-13 |
| 7557294 | Solar cell and production thereof | Yukiyoshi Ono | 2009-07-07 |
| 7513037 | Method of embedding components in multi-layer circuit boards | Mark Thomas McCormack, Hunt Hang Jiang, Michael G. Peters | 2009-04-07 |
| 7435295 | Method for producing compound single crystal and production apparatus for use therein | Yasuo Kitaoka, Hisashi Minemoto, Isao Kidoguchi, Takatomo Sasaki, Yusuke Mori +1 more | 2008-10-14 |
| 7381268 | Apparatus for production of crystal of group III element nitride and process for producing crystal of group III element nitride | Hisashi Minemoto, Yasuo Kitaoka, Isao Kidoguchi, Yusuke Mori, Fumio Kawamura +2 more | 2008-06-03 |
| 7002080 | Multilayer wiring board | Motoaki Tani, Nobuyuki Hayashi, Tomoyuki Abe, Takashi Shuto | 2006-02-21 |
| 6935124 | Clear ice making apparatus, clear ice making method and refrigerator | Katutosi Tusima, Takumi Kida, Yuko Ishii, Hiroshi Tatsui, Kazuyuki Hamada | 2005-08-30 |
| 6893553 | Hydroprocessing catalyst and use thereof | Satoshi Abe, Akira Hino, Mark de Boer | 2005-05-17 |
| 6869665 | Wiring board with core layer containing inorganic filler | Motoaki Tani, Nobuyuki Hayashi, Tomoyuki Abe, Yoshiyasu Saeki | 2005-03-22 |
| 6785447 | Single and multilayer waveguides and fabrication process | Tetsuzo Yoshimura, James J. Roman, Solomon I. Beilin, Wen-chou Vincent Wang, Masaaki Inao | 2004-08-31 |
| 6684007 | Optical coupling structures and the fabrication processes | Tetsuzo Yoshimura, James J. Roman, Mark Thomas McCormack, Solomon I. Beilin, Wen-chou Vincent Wang +1 more | 2004-01-27 |
| 6579474 | Conductive composition | Mark Thomas McCormack, Hunt Hang Jiang, Solomon I. Beilin, Albert W. Chan | 2003-06-17 |
| 6448106 | Modules with pins and methods for making modules with pins | Wen-chou Vincent Wang, Thomas J. Massingill, Lei Zhang | 2002-09-10 |
| 6428942 | Multilayer circuit structure build up method | Hunt Hang Jiang, Michael G. Lee, Wen-chou Vincent Wang, Mark Thomas McCormack | 2002-08-06 |
| 6389686 | Process for fabricating a thin multi-layer circuit board | Yasunaga Kurokawa, Kenji Iida, Masaru Sumi, Yuichiro Ohta, Toshiro Katsube +3 more | 2002-05-21 |
| 6281040 | Methods for making circuit substrates and electrical assemblies | Mark Thomas McCormack, Hunt Hang Jiang, Solomon I. Beilin, Albert W. Chan | 2001-08-28 |
| 6239485 | Reduced cross-talk noise high density signal interposer with power and ground wrap | Michael G. Peters, Wen-chou Vincent Wang, William T. Chou, Michael G. Lee, Solomon I. Beilin | 2001-05-29 |
| 6226171 | Power conducting substrates with high-yield integrated substrate capacitor | Solomon I. Beilin, William T. Chou, Michael G. Lee, David D. Ngo, Michael G. Peters +1 more | 2001-05-01 |
| D438891 | Cleaning cartridge | Hirohisa Hoshino, Hiroyuki Ohtsuka, Seiichi Irokawa, Hidenobu Kondo | 2001-03-13 |
| 6184476 | Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zone | Yasunaga Kurokawa, Kenji Iida, Masaru Sumi, Yuichiro Ohta, Toshiro Katsube +3 more | 2001-02-06 |
| 6168972 | Flip chip pre-assembly underfill process | Wen-chou Vincent Wang, Michael G. Peters, Dashun Steve Zhou | 2001-01-02 |