Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7513037 | Method of embedding components in multi-layer circuit boards | Mark Thomas McCormack, Hunt Hang Jiang, Yasuhito Takahashi | 2009-04-07 |
| 6898343 | Optical switching apparatus and method for fabricating | Alexei Glebov, Michael G. Lee, James J. Roman, David Kudzuma | 2005-05-24 |
| 6706546 | Optical reflective structures and method for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Kiyoshi Kuwabara, Solomon I. Beilin, Wen-chou Vincent Wang +1 more | 2004-03-16 |
| 6662443 | Method of fabricating a substrate with a via connection | William T. Chou, Solomon I. Beilin, Michael G. Lee, Wen-chou Vincent Wang | 2003-12-16 |
| 6521530 | Composite interposer and method for producing a composite interposer | Mark Thomas McCormack, Aris Bernales | 2003-02-18 |
| 6239485 | Reduced cross-talk noise high density signal interposer with power and ground wrap | Wen-chou Vincent Wang, Yasuhito Takahashi, William T. Chou, Michael G. Lee, Solomon I. Beilin | 2001-05-29 |
| 6226171 | Power conducting substrates with high-yield integrated substrate capacitor | Solomon I. Beilin, William T. Chou, Michael G. Lee, David D. Ngo, James J. Roman +1 more | 2001-05-01 |
| 6197664 | Method for electroplating vias or through holes in substrates having conductors on both sides | Michael G. Lee, William T. Chou | 2001-03-06 |
| 6187652 | Method of fabrication of multiple-layer high density substrate | William T. Chou, Solomon I. Beilin, Michael G. Lee, Wen-chou Vincent Wang | 2001-02-13 |
| 6168972 | Flip chip pre-assembly underfill process | Wen-chou Vincent Wang, Dashun Steve Zhou, Yasuhito Takahashi | 2001-01-02 |
| 6106923 | Venting hole designs for multilayer conductor-dielectric structures | Yasuhito Takahashi, Solomon I. Beilin | 2000-08-22 |
| 6102710 | Controlled impedance interposer substrate and method of making | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, James J. Roman +4 more | 2000-08-15 |
| 6081026 | High density signal interposer with power and ground wrap | Wen-chou Vincent Wang, Yasuhito Takahashi, William T. Chou, Michael G. Lee, Solomon I. Beilin | 2000-06-27 |
| 6039889 | Process flows for formation of fine structure layer pairs on flexible films | Lei Zhang, William T. Chou, Solomon I. Beilin | 2000-03-21 |
| 5891354 | Methods of etching through wafers and substrates with a composite etch stop layer | Michael G. Lee, Solomon I. Beilin, William T. Chou, Wen-chou Vincent Wang | 1999-04-06 |
| 5872696 | Sputtered and anodized capacitors capable of withstanding exposure to high temperatures | Michael G. Lee, Solomon I. Beilin, Yasuhito Takahashi | 1999-02-16 |
| 5854534 | Controlled impedence interposer substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, James J. Roman +4 more | 1998-12-29 |
| 5817533 | High-yield methods of fabricating large substrate capacitors | Bidyut Sen, Richard L. Wheeler, Wen-chou Vincent Wang | 1998-10-06 |
| 5778529 | Method of making a multichip module substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Teruo Murase +3 more | 1998-07-14 |
| 5652693 | Substrate with thin film capacitor and insulating plug | William T. Chou, Wen-chou Vincent Wang, Richard L. Wheeler | 1997-07-29 |
| 5607723 | Method for making continuous thin diamond film | Linda S. Plano, Kramadhati V. Ravi, John M. Pinneo | 1997-03-04 |
| 5567526 | Cemented tungsten carbide substrates having adherent diamond films coated thereon | Robert H. Cummings | 1996-10-22 |
| 5544017 | Multichip module substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Teruo Murase +3 more | 1996-08-06 |
| 5454161 | Through hole interconnect substrate fabrication process | Solomon I. Beilin, Michael G. Lee, Wen-chou Vincent Wang | 1995-10-03 |
| 5455064 | Process for fabricating a substrate with thin film capacitor and insulating plug | William T. Chou, Wen-chou Vincent Wang, Richard L. Wheeler | 1995-10-03 |