Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266583 | Flip chip package unit and associated packaging method | Yingjiang Pu, Xiuhong Guo | 2025-04-01 |
| 12159792 | Flip chip package unit comprising thermal protection film and associated packaging method | Yingjiang Pu, Xiuhong Guo | 2024-12-03 |
| 12002787 | Multi-die package structure and multi-die co-packing method | Yingjiang Pu | 2024-06-04 |
| 11824001 | Integrated circuit package structure and integrated circuit package unit | Yingjiang Pu, Xiuhong Guo | 2023-11-21 |
| 11670600 | Panel level metal wall grids array for integrated circuit packaging | Yingjiang Pu, Xiuhong Guo | 2023-06-06 |
| 11652029 | 3-D package structure for isolated power module and the method thereof | Jian Jiang, Di Han | 2023-05-16 |
| 11616017 | Integrated circuit package structure, integrated circuit package unit and associated packaging method | Yingjiang Pu, Xiuhong Guo | 2023-03-28 |
| 10461052 | Copper structures with intermetallic coating for integrated circuit chips | — | 2019-10-29 |
| 10083930 | Semiconductor device reducing parasitic loop inductance of system | Huaifeng Wang, Eric Braun, Francis Yu | 2018-09-25 |
| 9754909 | Copper structures with intermetallic coating for integrated circuit chips | — | 2017-09-05 |
| 9070671 | Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing | — | 2015-06-30 |
| 8906797 | Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing | — | 2014-12-09 |
| 8810013 | Integrated power converter package with die stacking | Eric Yang, Jinghai Zhou | 2014-08-19 |
| 8604597 | Multi-die packages incorporating flip chip dies and associated packaging methods | — | 2013-12-10 |
| 8461669 | Integrated power converter package with die stacking | Eric Yang, Jinghai Zhou | 2013-06-11 |
| 8361899 | Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing | — | 2013-01-29 |
| 8283758 | Microelectronic packages with enhanced heat dissipation and methods of manufacturing | — | 2012-10-09 |
| 8064202 | Sandwich structure with double-sided cooling and EMI shielding | Jian Yin, Kaiwei Yao | 2011-11-22 |
| 7999364 | Method and flip chip structure for power devices | — | 2011-08-16 |
| 7944048 | Chip scale package for power devices and method for making the same | — | 2011-05-17 |
| 7513037 | Method of embedding components in multi-layer circuit boards | Mark Thomas McCormack, Michael G. Peters, Yasuhito Takahashi | 2009-04-07 |
| 6869750 | Structure and method for forming a multilayered structure | Lei Zhang | 2005-03-22 |
| 6579474 | Conductive composition | Mark Thomas McCormack, Solomon I. Beilin, Albert W. Chan, Yasuhito Takahashi | 2003-06-17 |
| 6428942 | Multilayer circuit structure build up method | Yasuhito Takahashi, Michael G. Lee, Wen-chou Vincent Wang, Mark Thomas McCormack | 2002-08-06 |
| 6326555 | Method and structure of z-connected laminated substrate for high density electronic packaging | Mark Thomas McCormack, Thomas J. Massingill, Solomon I. Beilin | 2001-12-04 |