Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266583 | Flip chip package unit and associated packaging method | Yingjiang Pu, Hunt Hang Jiang | 2025-04-01 |
| 12159792 | Flip chip package unit comprising thermal protection film and associated packaging method | Yingjiang Pu, Hunt Hang Jiang | 2024-12-03 |
| 11860597 | Smart switch system | Xingwei Wang, Cheng-Chung Yang, I-Fan Chen | 2024-01-02 |
| 11824001 | Integrated circuit package structure and integrated circuit package unit | Yingjiang Pu, Hunt Hang Jiang | 2023-11-21 |
| 11670600 | Panel level metal wall grids array for integrated circuit packaging | Yingjiang Pu, Hunt Hang Jiang | 2023-06-06 |
| 11616017 | Integrated circuit package structure, integrated circuit package unit and associated packaging method | Yingjiang Pu, Hunt Hang Jiang | 2023-03-28 |