Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266583 | Flip chip package unit and associated packaging method | Hunt Hang Jiang, Xiuhong Guo | 2025-04-01 |
| 12159792 | Flip chip package unit comprising thermal protection film and associated packaging method | Hunt Hang Jiang, Xiuhong Guo | 2024-12-03 |
| 12002787 | Multi-die package structure and multi-die co-packing method | Hunt Hang Jiang | 2024-06-04 |
| 11824001 | Integrated circuit package structure and integrated circuit package unit | Hunt Hang Jiang, Xiuhong Guo | 2023-11-21 |
| 11670600 | Panel level metal wall grids array for integrated circuit packaging | Hunt Hang Jiang, Xiuhong Guo | 2023-06-06 |
| 11616017 | Integrated circuit package structure, integrated circuit package unit and associated packaging method | Hunt Hang Jiang, Xiuhong Guo | 2023-03-28 |