Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10910281 | Integrated circuit metallic ion diffusion defect validation | Louis Charles Kordus, II, Anik Mehta | 2021-02-02 |
| 9661770 | Graphic formation via material ablation | Raj N. Master, Michael J. Lane, Krishna Darbha, Ralf Groene, James Alec Ishihara +1 more | 2017-05-23 |
| 9563233 | Electronic device with plated electrical contact | Anthony Allen Fischer, Raj N. Master, Farah Shariff, Dennis Tom, Zulfiqar Alam | 2017-02-07 |
| 7513037 | Method of embedding components in multi-layer circuit boards | Hunt Hang Jiang, Michael G. Peters, Yasuhito Takahashi | 2009-04-07 |
| 7386197 | Method and apparatus for wafer level testing of integrated optical waveguide circuits | Dmitri E. Nikonov | 2008-06-10 |
| 7199307 | Structure and method for embedding capacitors in z-connected multi-chip modules | Mike Peters | 2007-04-03 |
| 6882045 | Multi-chip module and method for forming and method for deplating defective capacitors | Thomas J. Massingill, Wen-chou Vincent Wang | 2005-04-19 |
| 6866741 | Method for joining large substrates | Albert W. Chan, Michael G. Lee, Solomon I. Beilin | 2005-03-15 |
| 6859587 | Method and apparatus for wafer level testing of integrated optical waveguide circuits | Dmitri E. Nikonov | 2005-02-22 |
| 6759257 | Structure and method for embedding capacitors in z-connected multi-chip modules | Mike Peters | 2004-07-06 |
| 6684007 | Optical coupling structures and the fabrication processes | Tetsuzo Yoshimura, Yasuhito Takahashi, James J. Roman, Solomon I. Beilin, Wen-chou Vincent Wang +1 more | 2004-01-27 |
| 6669801 | Device transfer method | Tetsuzo Yoshimura, James J. Roman, Wen-chou Vincent Wang, Masaaki Inao | 2003-12-30 |
| 6603915 | Interposer and method for producing a light-guiding structure | Alexei Glebov | 2003-08-05 |
| 6579474 | Conductive composition | Hunt Hang Jiang, Solomon I. Beilin, Albert W. Chan, Yasuhito Takahashi | 2003-06-17 |
| 6572780 | Methods for fabricating flexible circuit structures | James J. Roman, Lei Zhang, Solomon I. Beilin | 2003-06-03 |
| 6544430 | Methods for detaching a layer from a substrate | James J. Roman, Lei Zhang, Solomon I. Beilin | 2003-04-08 |
| 6521530 | Composite interposer and method for producing a composite interposer | Michael G. Peters, Aris Bernales | 2003-02-18 |
| 6428942 | Multilayer circuit structure build up method | Hunt Hang Jiang, Yasuhito Takahashi, Michael G. Lee, Wen-chou Vincent Wang | 2002-08-06 |
| 6326555 | Method and structure of z-connected laminated substrate for high density electronic packaging | Hunt Hang Jiang, Thomas J. Massingill, Solomon I. Beilin | 2001-12-04 |
| 6281040 | Methods for making circuit substrates and electrical assemblies | Hunt Hang Jiang, Solomon I. Beilin, Albert W. Chan, Yasuhito Takahashi | 2001-08-28 |
| 6271107 | Semiconductor with polymeric layer | Thomas J. Massingill, Hunt Hang Jiang | 2001-08-07 |
| 6163957 | Multilayer laminated substrates with high density interconnects and methods of making the same | Hunt Hang Jiang, Thomas J. Massingill, Michael G. Lee | 2000-12-26 |
| 6054761 | Multi-layer circuit substrates and electrical assemblies having conductive composition connectors | Hunt Hang Jiang, Solomon I. Beilin, Albert W. Chan, Yasuhito Takahashi | 2000-04-25 |
| 5846366 | Method for interconnecting an electronic device using a transferable solder carrying medium | Sungho Jin | 1998-12-08 |
| 5834709 | Position sensing systems including magnetoresistive elements | Greg E. Blonder, Robert A. Boie, Sungho Jin | 1998-11-10 |