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Integrated circuit metallic ion diffusion defect validation |
Louis Charles Kordus, II, Anik Mehta |
2021-02-02 |
$129,593,000 |
| 9661770 |
Graphic formation via material ablation |
Raj N. Master, Michael J. Lane, Krishna Darbha, Ralf Groene, James Alec Ishihara +1 more |
2017-05-23 |
$34,380,000 |
| 9563233 |
Electronic device with plated electrical contact |
Anthony Allen Fischer, Raj N. Master, Farah Shariff, Dennis Tom, Zulfiqar Alam |
2017-02-07 |
$50,314,000 |
| 7513037 |
Method of embedding components in multi-layer circuit boards |
Hunt Hang Jiang, Michael G. Peters, Yasuhito Takahashi |
2009-04-07 |
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| 7386197 |
Method and apparatus for wafer level testing of integrated optical waveguide circuits |
Dmitri E. Nikonov |
2008-06-10 |
$23,380,000 |
| 7199307 |
Structure and method for embedding capacitors in z-connected multi-chip modules |
Mike Peters |
2007-04-03 |
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| 6882045 |
Multi-chip module and method for forming and method for deplating defective capacitors |
Thomas J. Massingill, Wen-chou Vincent Wang |
2005-04-19 |
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| 6866741 |
Method for joining large substrates |
Albert W. Chan, Michael G. Lee, Solomon I. Beilin |
2005-03-15 |
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| 6859587 |
Method and apparatus for wafer level testing of integrated optical waveguide circuits |
Dmitri E. Nikonov |
2005-02-22 |
$35,388,000 |
| 6759257 |
Structure and method for embedding capacitors in z-connected multi-chip modules |
Mike Peters |
2004-07-06 |
|
| 6684007 |
Optical coupling structures and the fabrication processes |
Tetsuzo Yoshimura, Yasuhito Takahashi, James J. Roman, Solomon I. Beilin, Wen-chou Vincent Wang +1 more |
2004-01-27 |
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| 6669801 |
Device transfer method |
Tetsuzo Yoshimura, James J. Roman, Wen-chou Vincent Wang, Masaaki Inao |
2003-12-30 |
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| 6603915 |
Interposer and method for producing a light-guiding structure |
Alexei Glebov |
2003-08-05 |
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| 6579474 |
Conductive composition |
Hunt Hang Jiang, Solomon I. Beilin, Albert W. Chan, Yasuhito Takahashi |
2003-06-17 |
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| 6572780 |
Methods for fabricating flexible circuit structures |
James J. Roman, Lei Zhang, Solomon I. Beilin |
2003-06-03 |
|
| 6544430 |
Methods for detaching a layer from a substrate |
James J. Roman, Lei Zhang, Solomon I. Beilin |
2003-04-08 |
|
| 6521530 |
Composite interposer and method for producing a composite interposer |
Michael G. Peters, Aris Bernales |
2003-02-18 |
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| 6428942 |
Multilayer circuit structure build up method |
Hunt Hang Jiang, Yasuhito Takahashi, Michael G. Lee, Wen-chou Vincent Wang |
2002-08-06 |
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| 6326555 |
Method and structure of z-connected laminated substrate for high density electronic packaging |
Hunt Hang Jiang, Thomas J. Massingill, Solomon I. Beilin |
2001-12-04 |
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| 6281040 |
Methods for making circuit substrates and electrical assemblies |
Hunt Hang Jiang, Solomon I. Beilin, Albert W. Chan, Yasuhito Takahashi |
2001-08-28 |
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| 6271107 |
Semiconductor with polymeric layer |
Thomas J. Massingill, Hunt Hang Jiang |
2001-08-07 |
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| 6163957 |
Multilayer laminated substrates with high density interconnects and methods of making the same |
Hunt Hang Jiang, Thomas J. Massingill, Michael G. Lee |
2000-12-26 |
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| 6054761 |
Multi-layer circuit substrates and electrical assemblies having conductive composition connectors |
Hunt Hang Jiang, Solomon I. Beilin, Albert W. Chan, Yasuhito Takahashi |
2000-04-25 |
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Method for interconnecting an electronic device using a transferable solder carrying medium |
Sungho Jin |
1998-12-08 |
$52,365,000 |
| 5834709 |
Position sensing systems including magnetoresistive elements |
Greg E. Blonder, Robert A. Boie, Sungho Jin |
1998-11-10 |
$45,052,000 |
