Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6866741 | Method for joining large substrates | Michael G. Lee, Mark Thomas McCormack, Solomon I. Beilin | 2005-03-15 |
| 6592943 | Stencil and method for depositing solder | Michael G. Lee, Theresa M. Larson | 2003-07-15 |
| 6579474 | Conductive composition | Mark Thomas McCormack, Hunt Hang Jiang, Solomon I. Beilin, Yasuhito Takahashi | 2003-06-17 |
| 6518096 | Interconnect assembly and Z-connection method for fine pitch substrates | Michael G. Lee | 2003-02-11 |
| 6281040 | Methods for making circuit substrates and electrical assemblies | Mark Thomas McCormack, Hunt Hang Jiang, Solomon I. Beilin, Yasuhito Takahashi | 2001-08-28 |
| 6054761 | Multi-layer circuit substrates and electrical assemblies having conductive composition connectors | Mark Thomas McCormack, Hunt Hang Jiang, Solomon I. Beilin, Yasuhito Takahashi | 2000-04-25 |
| 6047637 | Method of paste printing using stencil and masking layer | Michael G. Lee | 2000-04-11 |