Issued Patents All Time
Showing 1–25 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8212353 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Yuan-Liang Li, Bruce Euzent, Vadali Mahadev | 2012-07-03 |
| 8163642 | Package substrate with dual material build-up layers | — | 2012-04-24 |
| 7741160 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Yuan-Liang Li, Bruce Euzent, Vadali Mahadev | 2010-06-22 |
| 7602062 | Package substrate with dual material build-up layers | — | 2009-10-13 |
| 7585702 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Yuan-Liang Li, Bruce Euzent, Vadali Mahadev | 2009-09-08 |
| 7427813 | Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package | Yuan-Liang Li | 2008-09-23 |
| 7148569 | Pad surface finish for high routing density substrate of BGA packages | — | 2006-12-12 |
| 7144756 | Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate | Donald S. Fritz, Yuan-Liang Li | 2006-12-05 |
| 6949404 | Flip chip package with warpage control | Don Fritz, Yuan-Liang Li | 2005-09-27 |
| 6909176 | Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate | Donald S. Fritz, Yuan-Liang Li | 2005-06-21 |
| 6882045 | Multi-chip module and method for forming and method for deplating defective capacitors | Thomas J. Massingill, Mark Thomas McCormack | 2005-04-19 |
| 6845184 | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William T. Chou +3 more | 2005-01-18 |
| 6785447 | Single and multilayer waveguides and fabrication process | Tetsuzo Yoshimura, Yasuhito Takahashi, James J. Roman, Solomon I. Beilin, Masaaki Inao | 2004-08-31 |
| 6773958 | Integrated assembly-underfill flip chip process | — | 2004-08-10 |
| 6733685 | Methods of planarizing structures on wafers and substrates by polishing | Solomon I. Beilin, Michael G. Lee, William T. Chou, Larry L. Moresco | 2004-05-11 |
| 6706546 | Optical reflective structures and method for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Kiyoshi Kuwabara, Solomon I. Beilin, Michael G. Peters +1 more | 2004-03-16 |
| 6690845 | Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William T. Chou +3 more | 2004-02-10 |
| 6684007 | Optical coupling structures and the fabrication processes | Tetsuzo Yoshimura, Yasuhito Takahashi, James J. Roman, Mark Thomas McCormack, Solomon I. Beilin +1 more | 2004-01-27 |
| 6669801 | Device transfer method | Tetsuzo Yoshimura, James J. Roman, Masaaki Inao, Mark Thomas McCormack | 2003-12-30 |
| 6662443 | Method of fabricating a substrate with a via connection | William T. Chou, Solomon I. Beilin, Michael G. Lee, Michael G. Peters | 2003-12-16 |
| 6611635 | Opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William T. Chou +3 more | 2003-08-26 |
| 6543674 | Multilayer interconnection and method | Michael G. Lee, Connie M. Wong | 2003-04-08 |
| 6448106 | Modules with pins and methods for making modules with pins | Thomas J. Massingill, Yasuhito Takahashi, Lei Zhang | 2002-09-10 |
| 6444921 | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like | Michael G. Lee, Solomon I. Beilin | 2002-09-03 |
| 6428942 | Multilayer circuit structure build up method | Hunt Hang Jiang, Yasuhito Takahashi, Michael G. Lee, Mark Thomas McCormack | 2002-08-06 |