Bruce Euzent — 4 Patents at Intel

Bruce Euzent has been granted 4 US patents while listed as an inventor at Intel. The first was granted in 2007 and the most recent in July 2012. Bruce Euzent ranks #1,080,739 of 4,157,543 US inventors in our database (top 26.0%). Patent records list Bruce Euzent in Sunnyvale, CA, US.

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8212353	Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate	Wen-chou Vincent Wang, Yuan-Liang Li, Vadali Mahadev	2012-07-03	$15,014,000
7741160	Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate	Wen-chou Vincent Wang, Yuan-Liang Li, Vadali Mahadev	2010-06-22	$10,604,000
7585702	Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate	Wen-chou Vincent Wang, Yuan-Liang Li, Vadali Mahadev	2009-09-08	$3,731,000
7210081	Apparatus and methods for assessing reliability of assemblies using programmable logic devices	Roy Wu, Jeffrey Wayne Barton, Anil Pannikkat, Vadali Mahadev, Tomas Jonsson	2007-04-24	$16,654,000

Bruce Euzent — 4 Patents

Issued Patents All Time

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