Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8212353 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Wen-chou Vincent Wang, Yuan-Liang Li, Vadali Mahadev | 2012-07-03 |
| 7741160 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Wen-chou Vincent Wang, Yuan-Liang Li, Vadali Mahadev | 2010-06-22 |
| 7585702 | Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate | Wen-chou Vincent Wang, Yuan-Liang Li, Vadali Mahadev | 2009-09-08 |
| 7210081 | Apparatus and methods for assessing reliability of assemblies using programmable logic devices | Roy Wu, Jeffrey Wayne Barton, Anil Pannikkat, Vadali Mahadev, Tomas Jonsson | 2007-04-24 |