Issued Patents All Time
Showing 51–59 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5454161 | Through hole interconnect substrate fabrication process | Solomon I. Beilin, Michael G. Peters, Michael G. Lee | 1995-10-03 |
| 5455064 | Process for fabricating a substrate with thin film capacitor and insulating plug | William T. Chou, Michael G. Peters, Richard L. Wheeler | 1995-10-03 |
| 5426563 | Three-dimensional multichip module | Larry L. Moresco, David A. Horine | 1995-06-20 |
| 5419038 | Method for fabricating thin-film interconnector | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +2 more | 1995-05-30 |
| 5406446 | Thin film capacitor | Michael G. Peters, William T. Chou, Michael G. Lee, Solomon I. Beilin | 1995-04-11 |
| 5404265 | Interconnect capacitors | Larry L. Moresco, David G. Love | 1995-04-04 |
| 5382827 | Functional substrates for packaging semiconductor chips | William T. Chou | 1995-01-17 |
| 5376586 | Method of curing thin films of organic dielectric material | Solomon I. Beilin, William T. Chou | 1994-12-27 |
| 5323520 | Process for fabricating a substrate with thin film capacitor | Michael G. Peters, William T. Chou, Michael G. Lee, Solomon I. Beilin | 1994-06-28 |