Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6343171 | Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making | Tetsuzo Yoshimura, Yashuhito Takahashi, Masaaki Inao, Michael G. Lee, William T. Chou +3 more | 2002-01-29 |
| 6239485 | Reduced cross-talk noise high density signal interposer with power and ground wrap | Michael G. Peters, Yasuhito Takahashi, William T. Chou, Michael G. Lee, Solomon I. Beilin | 2001-05-29 |
| 6187652 | Method of fabrication of multiple-layer high density substrate | William T. Chou, Solomon I. Beilin, Michael G. Lee, Michael G. Peters | 2001-02-13 |
| 6168972 | Flip chip pre-assembly underfill process | Michael G. Peters, Dashun Steve Zhou, Yasuhito Takahashi | 2001-01-02 |
| 6102710 | Controlled impedance interposer substrate and method of making | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +4 more | 2000-08-15 |
| 6081026 | High density signal interposer with power and ground wrap | Yasuhito Takahashi, William T. Chou, Michael G. Peters, Michael G. Lee, Solomon I. Beilin | 2000-06-27 |
| 6050832 | Chip and board stress relief interposer | Michael G. Lee, Solomon I. Beilin | 2000-04-18 |
| 5942373 | Pattern or via structure formed through supplemental electron beam exposure and development to remove image residue | William T. Chou, Solomon I. Beilin | 1999-08-24 |
| 5930890 | Structure and fabrication procedure for a stable post | William T. Chou, Solomon I. Beilin, David A. Horine, David Kudzuma, Michael G. Lee +1 more | 1999-08-03 |
| 5916453 | Methods of planarizing structures on wafers and substrates by polishing | Solomon I. Beilin, Michael G. Lee, William T. Chou, Larry L. Moresco | 1999-06-29 |
| 5891354 | Methods of etching through wafers and substrates with a composite etch stop layer | Michael G. Lee, Solomon I. Beilin, William T. Chou, Michael G. Peters | 1999-04-06 |
| 5854534 | Controlled impedence interposer substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +4 more | 1998-12-29 |
| 5817533 | High-yield methods of fabricating large substrate capacitors | Bidyut Sen, Michael G. Peters, Richard L. Wheeler | 1998-10-06 |
| 5789140 | Method of forming a pattern or via structure utilizing supplemental electron beam exposure and development to remove image residue | William T. Chou, Solomon I. Beilin | 1998-08-04 |
| 5778529 | Method of making a multichip module substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Teruo Murase +3 more | 1998-07-14 |
| 5746903 | Wet chemical processing techniques for plating high aspect ratio features | Solomon I. Beilin, William T. Chou, Michael G. Lee | 1998-05-05 |
| 5722162 | Fabrication procedure for a stable post | William T. Chou, Solomon I. Beilin, David A. Horine, David Kudzuma, Michael G. Lee +1 more | 1998-03-03 |
| 5660957 | Electron-beam treatment procedure for patterned mask layers | William T. Chou, Solomon I. Beilin, David Kudzuma | 1997-08-26 |
| 5655290 | Method for making a three-dimensional multichip module | Larry L. Moresco, David A. Horine | 1997-08-12 |
| 5656414 | Methods of forming tall, high-aspect ratio vias and trenches in photo-imageable materials, photoresist materials, and the like | William T. Chou | 1997-08-12 |
| 5652693 | Substrate with thin film capacitor and insulating plug | William T. Chou, Michael G. Peters, Richard L. Wheeler | 1997-07-29 |
| 5544017 | Multichip module substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Teruo Murase +3 more | 1996-08-06 |
| 5514906 | Apparatus for cooling semiconductor chips in multichip modules | David G. Love, Larry L. Moresco, David A. Horine, Richard L. Wheeler, Patricia R. Boucher +1 more | 1996-05-07 |
| 5475262 | Functional substrates for packaging semiconductor chips | William T. Chou | 1995-12-12 |
| 5474458 | Interconnect carriers having high-density vertical connectors and methods for making the same | Habib Vafi, Solomon I. Beilin | 1995-12-12 |