Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9639126 | Apparatus for cooling a computer | Borys S. Senyk | 2017-05-02 |
| 8701747 | Method and an apparatus for cooling a computer | Borys S. Senyk | 2014-04-22 |
| 8016023 | Method and an apparatus for cooling a computer | Borys S. Senyk | 2011-09-13 |
| 7490656 | Method and an apparatus for cooling a computer | Borys S. Senyk | 2009-02-17 |
| 7086452 | Method and an apparatus for cooling a computer | Borys S. Senyk | 2006-08-08 |
| 6843421 | Molded memory module and method of making the module absent a substrate support | Khushrav S. Chhor | 2005-01-18 |
| 6798076 | Method and apparatus for encoding information in an IC package | John W. Horigan | 2004-09-28 |
| 6733685 | Methods of planarizing structures on wafers and substrates by polishing | Solomon I. Beilin, Michael G. Lee, William T. Chou, Wen-chou Vincent Wang | 2004-05-11 |
| 6539137 | Thermo-electric signal coupler | Vivek Mansingh, Teruo Murase | 2003-03-25 |
| 6535398 | Multichip module substrates with buried discrete capacitors and components and methods for making | — | 2003-03-18 |
| 6404047 | Socketable BGA package | Kevin Haley | 2002-06-11 |
| 6324436 | Method for optimizing cost of manufacturing memory arrays | — | 2001-11-27 |
| 6223814 | Flexible foil finned heatsink structure and method of making same | Vivek Mansingh | 2001-05-01 |
| 6221459 | Controlling the heat expansion of electrical couplings | Gregory A. James, Kristopher Frutschy | 2001-04-24 |
| 6168976 | Socketable BGA package | Kevin Haley | 2001-01-02 |
| 6111756 | Universal multichip interconnect systems | — | 2000-08-29 |
| 6102710 | Controlled impedance interposer substrate and method of making | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +4 more | 2000-08-15 |
| 6034332 | Power supply distribution structure for integrated circuit chip modules | Richard L. Wheeler, Solomon I. Beilin, David A. Horine | 2000-03-07 |
| 6026895 | Flexible foil finned heatsink structure and method of making same | Vivek Mansingh | 2000-02-22 |
| 5930890 | Structure and fabrication procedure for a stable post | William T. Chou, Solomon I. Beilin, David A. Horine, David Kudzuma, Michael G. Lee +1 more | 1999-08-03 |
| 5916453 | Methods of planarizing structures on wafers and substrates by polishing | Solomon I. Beilin, Michael G. Lee, William T. Chou, Wen-chou Vincent Wang | 1999-06-29 |
| 5897341 | Diffusion bonded interconnect | David G. Love | 1999-04-27 |
| 5854534 | Controlled impedence interposer substrate | Solomon I. Beilin, William T. Chou, David Kudzuma, Michael G. Lee, Michael G. Peters +4 more | 1998-12-29 |
| 5773889 | Wire interconnect structures for connecting an integrated circuit to a substrate | David G. Love, William T. Chou, David A. Horine, Connie M. Wong, Solomon I. Beilin | 1998-06-30 |
| 5765279 | Methods of manufacturing power supply distribution structures for multichip modules | Richard L. Wheeler, Solomon I. Beilin, David A. Horine | 1998-06-16 |