Kevin Haley — 19 Patents at Intel

Kevin Haley has been granted 19 US patents while listed as an inventor at Intel. The first was granted in 1991 and the most recent in November 2006. Kevin Haley ranks #229,345 of 4,157,543 US inventors in our database (top 5.5%). Patent records list Kevin Haley in San Jose, CA, US.

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
7132313	Diamond heat spreading and cooling technique for integrated circuits	Michael O'Connor, Biswajit Sur	2006-11-07	$13,207,000
6667548	Diamond heat spreading and cooling technique for integrated circuits	Michael O'Connor, Biswajit Sur	2003-12-23	$55,491,000
6404047	Socketable BGA package	Larry L. Moresco	2002-06-11	$104,024,000
6313987	Thermal connector for joining mobile electronic devices to docking stations	Michael O'Connor	2001-11-06	$210,286,000
6181555	Cooling system for integrated circuit chips in a portable computer	Michael O'Connor, Rakesh Bhatia	2001-01-30	$161,472,000
6168976	Socketable BGA package	Larry L. Moresco	2001-01-02	$205,888,000
6043560	Thermal interface thickness control for a microprocessor	Niel C. Delaplane, Ravindranath V. Mahajan, Robert Starkston, Charles A. Gealer, Joseph C. Krauskopf	2000-03-28	$241,499,000
5982617	Cooling system for integrated circuit chips in a portable computer lid assembly	Michael O'Connor, Rakesh Bhatia	1999-11-09	$145,120,000
5966286	Cooling system for thin profile electronic and computer devices	Michael O'Connor, Rakesh Bhatia, Daniel Thomas Adams, Michael Kast	1999-10-12	$143,616,000
5956229	Injection molded thermal interface system	Michael Brownell, Dan R. McCutchan, Hong Xie	1999-09-21	$160,271,000
5718282	Heat pipe exchanger system for cooling a hinged computing device	Rakesh Bhatia	1998-02-17	$169,432,000
5646822	Heat pipe exchanger system for cooling a hinged computing device	Rakesh Bhatia	1997-07-08	$150,606,000
5621613	Apparatus for dissipating heat in a hinged computing device	Mostafa Aghazadeh, Hong Xie	1997-04-15	$49,693,000
5531021	Method of making solder shape array package	Frank Kolman	1996-07-02	$53,654,000
5506756	Tape BGA package die-up/die down	—	1996-04-09	$88,331,000
5359768	Method for mounting very small integrated circuit package on PCB	—	1994-11-01	$41,604,000
5359225	Thin, high leadcount package	—	1994-10-25	$40,369,000
5290735	Thin, high leadcount package	—	1994-03-01	$57,936,000
5006962	Apparatus for surface mounting an integrated circuit package	—	1991-04-09	$43,220,000

Kevin Haley — 19 Patents

Issued Patents All Time

Patent Widget