Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7132313 | Diamond heat spreading and cooling technique for integrated circuits | Michael O'Connor, Biswajit Sur | 2006-11-07 |
| 6667548 | Diamond heat spreading and cooling technique for integrated circuits | Michael O'Connor, Biswajit Sur | 2003-12-23 |
| 6404047 | Socketable BGA package | Larry L. Moresco | 2002-06-11 |
| 6313987 | Thermal connector for joining mobile electronic devices to docking stations | Michael O'Connor | 2001-11-06 |
| 6181555 | Cooling system for integrated circuit chips in a portable computer | Michael O'Connor, Rakesh Bhatia | 2001-01-30 |
| 6168976 | Socketable BGA package | Larry L. Moresco | 2001-01-02 |
| 6043560 | Thermal interface thickness control for a microprocessor | Niel C. Delaplane, Ravindranath V. Mahajan, Robert Starkston, Charles A. Gealer, Joseph C. Krauskopf | 2000-03-28 |
| 5982617 | Cooling system for integrated circuit chips in a portable computer lid assembly | Michael O'Connor, Rakesh Bhatia | 1999-11-09 |
| 5966286 | Cooling system for thin profile electronic and computer devices | Michael O'Connor, Rakesh Bhatia, Daniel Thomas Adams, Michael Kast | 1999-10-12 |
| 5956229 | Injection molded thermal interface system | Michael Brownell, Dan R. McCutchan, Hong Xie | 1999-09-21 |
| 5718282 | Heat pipe exchanger system for cooling a hinged computing device | Rakesh Bhatia | 1998-02-17 |
| 5646822 | Heat pipe exchanger system for cooling a hinged computing device | Rakesh Bhatia | 1997-07-08 |
| 5621613 | Apparatus for dissipating heat in a hinged computing device | Mostafa Aghazadeh, Hong Xie | 1997-04-15 |
| 5531021 | Method of making solder shape array package | Frank Kolman | 1996-07-02 |
| 5506756 | Tape BGA package die-up/die down | — | 1996-04-09 |
| 5359768 | Method for mounting very small integrated circuit package on PCB | — | 1994-11-01 |
| 5359225 | Thin, high leadcount package | — | 1994-10-25 |
| 5290735 | Thin, high leadcount package | — | 1994-03-01 |
| 5006962 | Apparatus for surface mounting an integrated circuit package | — | 1991-04-09 |