| 7132313 |
Diamond heat spreading and cooling technique for integrated circuits |
Michael O'Connor, Biswajit Sur |
2006-11-07 |
| 6667548 |
Diamond heat spreading and cooling technique for integrated circuits |
Michael O'Connor, Biswajit Sur |
2003-12-23 |
| 6404047 |
Socketable BGA package |
Larry L. Moresco |
2002-06-11 |
| 6313987 |
Thermal connector for joining mobile electronic devices to docking stations |
Michael O'Connor |
2001-11-06 |
| 6181555 |
Cooling system for integrated circuit chips in a portable computer |
Michael O'Connor, Rakesh Bhatia |
2001-01-30 |
| 6168976 |
Socketable BGA package |
Larry L. Moresco |
2001-01-02 |
| 6043560 |
Thermal interface thickness control for a microprocessor |
Niel C. Delaplane, Ravindranath V. Mahajan, Robert Starkston, Charles A. Gealer, Joseph C. Krauskopf |
2000-03-28 |
| 5982617 |
Cooling system for integrated circuit chips in a portable computer lid assembly |
Michael O'Connor, Rakesh Bhatia |
1999-11-09 |
| 5966286 |
Cooling system for thin profile electronic and computer devices |
Michael O'Connor, Rakesh Bhatia, Daniel Thomas Adams, Michael Kast |
1999-10-12 |
| 5956229 |
Injection molded thermal interface system |
Michael Brownell, Dan R. McCutchan, Hong Xie |
1999-09-21 |
| 5718282 |
Heat pipe exchanger system for cooling a hinged computing device |
Rakesh Bhatia |
1998-02-17 |
| 5646822 |
Heat pipe exchanger system for cooling a hinged computing device |
Rakesh Bhatia |
1997-07-08 |
| 5621613 |
Apparatus for dissipating heat in a hinged computing device |
Mostafa Aghazadeh, Hong Xie |
1997-04-15 |
| 5531021 |
Method of making solder shape array package |
Frank Kolman |
1996-07-02 |
| 5506756 |
Tape BGA package die-up/die down |
— |
1996-04-09 |
| 5359768 |
Method for mounting very small integrated circuit package on PCB |
— |
1994-11-01 |
| 5359225 |
Thin, high leadcount package |
— |
1994-10-25 |
| 5290735 |
Thin, high leadcount package |
— |
1994-03-01 |
| 5006962 |
Apparatus for surface mounting an integrated circuit package |
— |
1991-04-09 |