| 6782611 |
Method of assembling a multi-chip device |
William A. Samaras, Paul T. Phillips |
2004-08-31 |
$18,815,000 |
| 6614829 |
Mechanically grounded tunable laser |
Alexander V. Tuganov, I-Fan Wu, Timothy Day |
2003-09-02 |
$2,079,000 |
| 6506073 |
Mounting bracket for integrated circuit device |
Dan R. McCutchan, Glen P. Gordon, Leonard O. Turner, Larry B. Wheeler |
2003-01-14 |
$60,878,000 |
| 6490167 |
Semiconductor package ejector |
James G. Maveety, Richard Michael Ramirez, William A. Samaras |
2002-12-03 |
$79,622,000 |
| 6443749 |
Fixed position ZIF (zero insertion force) socket system |
Jim Maveety |
2002-09-03 |
$41,426,000 |
| 6410982 |
Heatpipesink having integrated heat pipe and heat sink |
James G. Maveety |
2002-06-25 |
$55,737,000 |
| 6349465 |
Controlled bondline thickness attachment mechanism |
Gregory Turturro, Dan R. McCutchan |
2002-02-26 |
$96,208,000 |
| 6164999 |
Zero insertion force socket and method for employing same to mount a processor |
Dan R. McCutchan, Glen P. Gordon, Leonard O. Turner, Larry B. Wheeler |
2000-12-26 |
$173,686,000 |
| 6166908 |
Integrated circuit cartridge |
Bill Samaras, Dan R. McCutchan, Hong Xie |
2000-12-26 |
$173,686,000 |
| 6097611 |
Multi-chip land grid array carrier |
William A. Samaras, Paul T. Phillips |
2000-08-01 |
$353,604,000 |
| 6016006 |
Thermal grease insertion and retention |
Frank Kolman |
2000-01-18 |
$313,973,000 |
| 6002591 |
Printed circuit board mounting assembly and a method for mounting an integrated circuit device |
Dan R. McCutchan, Glen P. Gordon, Leonard O. Turner, Larry B. Wheeler |
1999-12-14 |
$215,609,000 |
| 5990552 |
Apparatus for attaching a heat sink to the back side of a flip chip package |
Hong Xie |
1999-11-23 |
$130,919,000 |
| 5991161 |
Multi-chip land grid array carrier |
William A. Samaras, Paul T. Phillips |
1999-11-23 |
$130,919,000 |
| 5956229 |
Injection molded thermal interface system |
Dan R. McCutchan, Hong Xie, Kevin Haley |
1999-09-21 |
$160,271,000 |
| 5953164 |
Wide range cylindrical mirror mount with radial clamp |
David F. Arnone, Sherwin D. Cabatic, Khiem Ba Do |
1999-09-14 |
|
| 5949647 |
Heat pipe to baseplate attachment method |
Frank Kolman, Hong Xie |
1999-09-07 |
$115,425,000 |
| 5903436 |
Emulative lid/heatspreader for processor die attached to an organic substrate |
Nagesh Vodrahalli, James G. Maveery, Richard Michael Ramirez |
1999-05-11 |
$87,534,000 |
| 5847885 |
Wide range cylindrical mirror mount with radial clamp |
David F. Arnone, Sherwin D. Cabatic, Khiem Ba Do |
1998-12-08 |
|
| 5802707 |
Controlled bondline thickness attachment mechanism |
Gregory Turturro, Dan R. McCutchan |
1998-09-08 |
$57,567,000 |
| 5699227 |
Heat pipe to baseplate attachment method |
Frank Kolman, Hong Xie |
1997-12-16 |
$78,645,000 |
| 5699229 |
Compliant hinge clip attachment |
— |
1997-12-16 |
$78,645,000 |
