Patents per Year
Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6349465 | Controlled bondline thickness attachment mechanism | Michael Brownell, Dan R. McCutchan | 2002-02-26 | $96,208,000 |
| 6088915 | C4-GT stand off rigid flex interposer method | — | 2000-07-18 | $254,203,000 |
| 6049124 | Semiconductor package | George F. Raiser | 2000-04-11 | $329,343,000 |
| 5965937 | Thermal interface attach mechanism for electrical packages | Chia-Pin Chiu | 1999-10-12 | $143,616,000 |
| 5936838 | MPC module with exposed C4 die and removal thermal plate design | Mirng-Ji Lii, Chia-Pin Chiu | 1999-08-10 | $109,908,000 |
| 5889652 | C4-GT stand off rigid flex interposer | — | 1999-03-30 | $45,277,000 |
| 5883783 | GT clip design for an electronic packaging assembly | — | 1999-03-16 | $139,495,000 |
| 5802707 | Controlled bondline thickness attachment mechanism | Michael Brownell, Dan R. McCutchan | 1998-09-08 | $57,567,000 |
| 5513070 | Dissipation of heat through keyboard using a heat pipe | Hong Xie, Mostafa Aghazadeh, Chia-Pin Chiu | 1996-04-30 | $55,735,000 |