Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6700209 | Partial underfill for flip-chip electronic packages | Bob Sundahl, Ravi Mahajan | 2004-03-02 |
| 6365441 | Partial underfill for flip-chip electronic packages | Bob Sundahl, Ravi Mahajan | 2002-04-02 |
| 6049124 | Semiconductor package | Gregory Turturro | 2000-04-11 |
| 5936304 | C4 package die backside coating | Mirng-Ji Lii, Ravi Mahajan, Brad Menzies | 1999-08-10 |