| 12107042 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni |
2024-10-01 |
$20,560,000 |
| 11984396 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni |
2024-05-14 |
$33,809,000 |
| 11515248 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni |
2022-11-29 |
$14,086,000 |
| 10796988 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni |
2020-10-06 |
$29,609,000 |
| 9941245 |
Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate |
Oswald Skeete, John S. Guzek |
2018-04-10 |
$20,820,000 |
| 9941246 |
Electronic assembly that includes stacked electronic devices |
Nitin A. Deshpande |
2018-04-10 |
$20,820,000 |
| 9820384 |
Flexible electronic assembly method |
Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more |
2017-11-14 |
$11,178,000 |
| 9269701 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni |
2016-02-23 |
$10,383,000 |
| 9136236 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni |
2015-09-15 |
$17,844,000 |
| RE44629 |
Process for assembling an integrated circuit package having a substrate vent hole |
Suresh Ramalingam, Nagesh Vodrahalli, Michael J. Costello, Mun Leong Loke |
2013-12-10 |
|
| 8441809 |
Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same |
Sandeep B. Sane |
2013-05-14 |
$17,697,000 |
| 8064224 |
Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same |
Sandeep B. Sane |
2011-11-22 |
$16,463,000 |
| 7882624 |
Method of forming electronic package having fluid-conducting channel |
Chuan Hu |
2011-02-08 |
$12,723,000 |
| 7851905 |
Microelectronic package and method of cooling an interconnect feature in same |
Gregory M. Chrysler, Chia-Pin Chiu |
2010-12-14 |
$13,117,000 |
| 7764499 |
Electromagnetically-actuated micropump for liquid metal alloy |
Ioan Sauciuc |
2010-07-27 |
$20,041,000 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu +2 more |
2009-08-18 |
$24,226,000 |
| 7539016 |
Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls |
Ioan Sauciuc |
2009-05-26 |
$14,272,000 |
| 7508671 |
Computer system having controlled cooling |
Ioan Sauciuc, Gregory M. Chrysler |
2009-03-24 |
$27,396,000 |
| 7279796 |
Microelectronic die having a thermoelectric module |
Chuan Hu, Gregory M. Chrysler |
2007-10-09 |
$11,205,000 |
| 7126822 |
Electronic packages, assemblies, and systems with fluid cooling |
Chuan Hu |
2006-10-24 |
$13,658,000 |
| 6992381 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu +2 more |
2006-01-31 |
$19,938,000 |
| 6934154 |
Micro-channel heat exchangers and spreaders |
Ravi Prasher |
2005-08-23 |
$20,377,000 |
| 6908845 |
Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
Johanna M. Swan, Bala Natarajan |
2005-06-21 |
$21,477,000 |
| 6903929 |
Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink |
Ravi Prasher |
2005-06-07 |
$27,808,000 |
| 6706562 |
Electronic assembly with high capacity thermal spreader and methods of manufacture |
Gregory M. Chrysler |
2004-03-16 |
$26,262,000 |
