Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107042 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni | 2024-10-01 |
| 11984396 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni | 2024-05-14 |
| 11515248 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni | 2022-11-29 |
| 10796988 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni | 2020-10-06 |
| 9941245 | Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate | Oswald Skeete, John S. Guzek | 2018-04-10 |
| 9941246 | Electronic assembly that includes stacked electronic devices | Nitin A. Deshpande | 2018-04-10 |
| 9820384 | Flexible electronic assembly method | Sasha N. Oster, Robert L. Sankman, Charles A. Gealer, Omkar G. Karhade, John S. Guzek +8 more | 2017-11-14 |
| 9269701 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni | 2016-02-23 |
| 9136236 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni | 2015-09-15 |
| RE44629 | Process for assembling an integrated circuit package having a substrate vent hole | Suresh Ramalingam, Nagesh Vodrahalli, Michael J. Costello, Mun Leong Loke | 2013-12-10 |
| 8441809 | Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same | Sandeep B. Sane | 2013-05-14 |
| 8064224 | Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same | Sandeep B. Sane | 2011-11-22 |
| 7882624 | Method of forming electronic package having fluid-conducting channel | Chuan Hu | 2011-02-08 |
| 7851905 | Microelectronic package and method of cooling an interconnect feature in same | Gregory M. Chrysler, Chia-Pin Chiu | 2010-12-14 |
| 7764499 | Electromagnetically-actuated micropump for liquid metal alloy | Ioan Sauciuc | 2010-07-27 |
| 7576432 | Using external radiators with electroosmotic pumps for cooling integrated circuits | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu +2 more | 2009-08-18 |
| 7539016 | Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls | Ioan Sauciuc | 2009-05-26 |
| 7508671 | Computer system having controlled cooling | Ioan Sauciuc, Gregory M. Chrysler | 2009-03-24 |
| 7279796 | Microelectronic die having a thermoelectric module | Chuan Hu, Gregory M. Chrysler | 2007-10-09 |
| 7126822 | Electronic packages, assemblies, and systems with fluid cooling | Chuan Hu | 2006-10-24 |
| 6992381 | Using external radiators with electroosmotic pumps for cooling integrated circuits | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Quat Vu +2 more | 2006-01-31 |
| 6934154 | Micro-channel heat exchangers and spreaders | Ravi Prasher | 2005-08-23 |
| 6908845 | Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme | Johanna M. Swan, Bala Natarajan | 2005-06-21 |
| 6903929 | Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink | Ravi Prasher | 2005-06-07 |
| 6706562 | Electronic assembly with high capacity thermal spreader and methods of manufacture | Gregory M. Chrysler | 2004-03-16 |