Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308329 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Rahul N. Manepalli, Xiaoying Guo | 2025-05-20 |
| 12107042 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan | 2024-10-01 |
| 12080632 | Glass core package substrates | Rahul Agarwal, Rajasekaran Swaminathan, Chintan Buch | 2024-09-03 |
| 11990427 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Rahul N. Manepalli, Xiaoying Guo | 2024-05-21 |
| 11984396 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan | 2024-05-14 |
| 11973041 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Rahul N. Manepalli, Xiaoying Guo | 2024-04-30 |
| 11769735 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Gang Duan, Rahul N. Manepalli, Xiaoying Guo | 2023-09-26 |
| 11515248 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan | 2022-11-29 |
| 10796988 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan | 2020-10-06 |
| 10453799 | Logic die and other components embedded in build-up layers | Russell K. Mortensen, John S. Guzek | 2019-10-22 |
| 10366951 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravindranath V. Mahajan | 2019-07-30 |
| 9808875 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Carl Deppisch, Leonel Arana, Gregory S. Constable, Sriram Srinivasan | 2017-11-07 |
| 9679843 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravindranath V. Mahajan | 2017-06-13 |
| 9601421 | BBUL material integration in-plane with embedded die for warpage control | Weng Hong Teh | 2017-03-21 |
| 9520376 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek | 2016-12-13 |
| 9496211 | Logic die and other components embedded in build-up layers | Russell K. Mortensen, John S. Guzek | 2016-11-15 |
| 9269701 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan | 2016-02-23 |
| 9254532 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Carl Deppisch, Leonel Arana, Gregory S. Constable, Sriram Srinivasan | 2016-02-09 |
| 9153552 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek | 2015-10-06 |
| 9136236 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan | 2015-09-15 |
| 8912670 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek | 2014-12-16 |