| 12308329 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Rahul N. Manepalli, Xiaoying Guo |
2025-05-20 |
|
| 12107042 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan |
2024-10-01 |
$20,560,000 |
| 12080632 |
Glass core package substrates |
Rahul Agarwal, Rajasekaran Swaminathan, Chintan Buch |
2024-09-03 |
$326,917,000 |
| 11990427 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Rahul N. Manepalli, Xiaoying Guo |
2024-05-21 |
$18,840,000 |
| 11984396 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan |
2024-05-14 |
$33,809,000 |
| 11973041 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Rahul N. Manepalli, Xiaoying Guo |
2024-04-30 |
$26,151,000 |
| 11769735 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Rahul N. Manepalli, Xiaoying Guo |
2023-09-26 |
$20,953,000 |
| 11515248 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan |
2022-11-29 |
$14,086,000 |
| 10796988 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan |
2020-10-06 |
$29,609,000 |
| 10453799 |
Logic die and other components embedded in build-up layers |
Russell K. Mortensen, John S. Guzek |
2019-10-22 |
$16,310,000 |
| 10366951 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravindranath V. Mahajan |
2019-07-30 |
$29,864,000 |
| 9808875 |
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby |
Carl Deppisch, Leonel Arana, Gregory S. Constable, Sriram Srinivasan |
2017-11-07 |
$13,901,000 |
| 9679843 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravindranath V. Mahajan |
2017-06-13 |
$8,497,000 |
| 9601421 |
BBUL material integration in-plane with embedded die for warpage control |
Weng Hong Teh |
2017-03-21 |
$8,001,000 |
| 9520376 |
Bumpless build-up layer package including an integrated heat spreader |
Weng Hong Teh, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek |
2016-12-13 |
$15,488,000 |
| 9496211 |
Logic die and other components embedded in build-up layers |
Russell K. Mortensen, John S. Guzek |
2016-11-15 |
$10,003,000 |
| 9269701 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan |
2016-02-23 |
$10,383,000 |
| 9254532 |
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby |
Carl Deppisch, Leonel Arana, Gregory S. Constable, Sriram Srinivasan |
2016-02-09 |
$15,927,000 |
| 9153552 |
Bumpless build-up layer package including an integrated heat spreader |
Weng Hong Teh, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek |
2015-10-06 |
$14,030,000 |
| 9136236 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan |
2015-09-15 |
$17,844,000 |
| 8912670 |
Bumpless build-up layer package including an integrated heat spreader |
Weng Hong Teh, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek |
2014-12-16 |
$19,599,000 |
