Issued Patents All Time
Showing 25 most recent of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more | 2025-09-09 |
| 12411939 | Vertically integrated automatic threat level determination for containers and hosts in a containerization environment | Henrik Rosendahl, Fei Huang | 2025-09-09 |
| 12400363 | Device and method for improved fiducial marker detection | Yi Li, Hong Seung YEON, Nicholas S. Haehn, Wei Li, Raquel DE SOUZA BORGES FERREIRA +4 more | 2025-08-26 |
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more | 2025-07-08 |
| 12354992 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Aleksandar Aleksov, Steve Cho, Leonel Arana +1 more | 2025-07-08 |
| 12327797 | Microelectronic structures including glass cores | Srinivas V. Pietambaram, Tarek A. Ibrahim, Sai Vadlamani, Bharat P. Penmecha | 2025-06-10 |
| 12308329 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2025-05-20 |
| 12244625 | Application layer data protection for containers in a containerization environment | Fei Huang, Zang Li | 2025-03-04 |
| 12230430 | Substrate embedded magnetic core inductors and method of making | Srinivas V. Pietambaram, Kristof Darmawikarta, Yonggang Li, Sameer Paital | 2025-02-18 |
| 12191240 | Hybrid glass core for wafer level and panel level packaging applications | Jieying Kong, Srinivas V. Pietambaram | 2025-01-07 |
| 12125777 | Minimizing package impedance discontinuity through dielectric structure optimizations | Zhiguo Qian, Kemal Aygun, Jieying Kong, Brandon C. Marin | 2024-10-22 |
| 12125793 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Rahul N. Manepalli | 2024-10-22 |
| 12088560 | Network context monitoring within service mesh containerization environment | Yuncong Feng | 2024-09-10 |
| 12087695 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Rahul N. Manepalli | 2024-09-10 |
| 12009320 | Interconnect loss of high density package with magnetic material | Zhiguo Qian, Cemil Geyik, Jiwei Sun, Kemal Aygun | 2024-06-11 |
| 11990427 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2024-05-21 |
| 11978685 | Glass core patch with in situ fabricated fan-out layer to enable die tiling applications | Srinivas V. Pietambaram, Robert L. Sankman, Rahul N. Manepalli, Debendra Mallik | 2024-05-07 |
| 11973041 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2024-04-30 |
| 11966463 | Automatic deployment of application security policy using application manifest and dynamic process analysis in a containerization environment | Glen K. Kosaka, Fei Huang | 2024-04-23 |
| 11929212 | Method to form high capacitance thin film capacitors (TFCs) as embedded passives in organic substrate packages | Sameer Paital, Srinivas V. Pietambaram, Kristof Darmawikarta | 2024-03-12 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng, Wei-Lun Kane Jen +6 more | 2024-03-05 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Srinivas V. Pietambaram, Jesse C. Jones, Yosuke Kanaoka, Hongxia Feng +10 more | 2024-03-05 |
| 11886573 | Vertically integrated automatic threat level determination for containers and hosts in a containerization environment | Henrik Rosendahl, Fei Huang | 2024-01-30 |
| 11817349 | Conductive route patterning for electronic substrates | Jeremy Ecton, Brandon C. Marin, Leonel Arana, Matthew Tingey, Oscar Ojeda +3 more | 2023-11-14 |
| 11792216 | Application layer data protection for containers in a containerization environment | Fei Huang, Zang Li | 2023-10-17 |