| 12482733 |
Ground via clustering for crosstalk mitigation |
Zhiguo Qian, Yuan Zhang |
2025-11-25 |
|
| 12413001 |
Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package |
Zhichao Zhang, Zhe Chen, Steven A. Klein, Feifei Cheng, Srikant Nekkanty +2 more |
2025-09-09 |
|
| 12347788 |
Glass substrates having signal shielding for use with semiconductor packages and related methods |
Kristof Darmawikarta, Srinivas V. Pietambaram, Telesphor Kamgaing, Zhiguo Qian, Jiwei Sun |
2025-07-01 |
|
| 12313890 |
Through-substrate optical vias |
Pooya Tadayon, Zhichao Zhang, Brandon C. Marin, Tarek A. Ibrahim, Stephen Andrew Smith |
2025-05-27 |
|
| 12148744 |
Optical multichip package with multiple system-on-chip dies |
Zhichao Zhang, Suresh Pothukuchi, Xiaoqian Li, Omkar G. Karhade |
2024-11-19 |
$25,575,000 |
| 12125777 |
Minimizing package impedance discontinuity through dielectric structure optimizations |
Zhiguo Qian, Gang Duan, Jieying Kong, Brandon C. Marin |
2024-10-22 |
$18,859,000 |
| 12062616 |
Power delivery for embedded bridge die utilizing trench structures |
Zhiguo Qian, Jianyong Xie |
2024-08-13 |
$26,861,000 |
| 12057413 |
Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost |
Lijiang Wang, Jianyong Xie, Arghya Sain, Xiaohong Jiang, Sujit Sharan |
2024-08-06 |
$17,070,000 |
| 12009320 |
Interconnect loss of high density package with magnetic material |
Zhiguo Qian, Cemil Geyik, Jiwei Sun, Gang Duan |
2024-06-11 |
$21,221,000 |
| 11983135 |
Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge |
Dheeraj Subbareddy, Ankireddy Nalamalpu, Anshuman Thakur, MD Altaf Hossain, Mahesh Kumashikar +3 more |
2024-05-14 |
$33,809,000 |
| 11923308 |
Die interconnect structures having bump field and ground plane |
Zhiguo Qian |
2024-03-05 |
$29,696,000 |
| 11903138 |
Fine feature formation techniques for printed circuit boards |
Eric J. Li, Kai Xiao, Gong Ouyang, Zhichao Zhang |
2024-02-13 |
$18,546,000 |
| 11901280 |
Ground via clustering for crosstalk mitigation |
Zhiguo Qian, Yu Zhang |
2024-02-13 |
$18,546,000 |
| 11887932 |
Dielectric-filled trench isolation of vias |
Zhiguo Qian, Jianyong Xie |
2024-01-30 |
$30,721,000 |
| 11837549 |
Power delivery for embedded bridge die utilizing trench structures |
Zhiguo Qian, Jianyong Xie |
2023-12-05 |
$33,749,000 |
| 11817391 |
Power delivery for embedded bridge die utilizing trench structures |
Zhiguo Qian, Jianyong Xie |
2023-11-14 |
$31,444,000 |
| 11810859 |
Multi-layered adhesion promotion films |
Srinivas V. Pietambaram, Rahul N. Manepalli, Cemil Geyik |
2023-11-07 |
$22,371,000 |
| 11742275 |
Ground via clustering for crosstalk mitigation |
Zhiguo Qian, Yu Zhang |
2023-08-29 |
$19,273,000 |
| 11737227 |
Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket |
Zhichao Zhang, Gregorio R. Murtagian, Kuang Liu |
2023-08-22 |
$16,803,000 |
| 11715889 |
Slow wave structure for millimeter wave antennas |
Zhichao Zhang, Jiwei Sun |
2023-08-01 |
$26,467,000 |
| 11694952 |
Horizontal pitch translation using embedded bridge dies |
Sujit Sharan, Zhiguo Qian, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie |
2023-07-04 |
|
| 11682613 |
Package substrates with magnetic build-up layers |
Zhiguo Qian, Kaladhar Radhakrishnan |
2023-06-20 |
$18,411,000 |
| 11621227 |
Power delivery for embedded bridge die utilizing trench structures |
Zhiguo Qian, Jianyong Xie |
2023-04-04 |
$21,090,000 |
| 11574862 |
Optimal signal routing performance through dielectric material configuration designs in package substrate |
Zhiguo Qian, Gang Duan, Jieying Kong |
2023-02-07 |
$11,877,000 |
| 11545416 |
Minimization of insertion loss variation in through-silicon vias (TSVs) |
Jianyong Xie, Yidnekachew S. Mekonnen, Zhiguo Qian |
2023-01-03 |
$15,575,000 |
