Issued Patents All Time
Showing 25 most recent of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12413001 | Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package | Zhichao Zhang, Zhe Chen, Steven A. Klein, Feifei Cheng, Srikant Nekkanty +2 more | 2025-09-09 |
| 12347788 | Glass substrates having signal shielding for use with semiconductor packages and related methods | Kristof Darmawikarta, Srinivas V. Pietambaram, Telesphor Kamgaing, Zhiguo Qian, Jiwei Sun | 2025-07-01 |
| 12313890 | Through-substrate optical vias | Pooya Tadayon, Zhichao Zhang, Brandon C. Marin, Tarek A. Ibrahim, Stephen Andrew Smith | 2025-05-27 |
| 12148744 | Optical multichip package with multiple system-on-chip dies | Zhichao Zhang, Suresh Pothukuchi, Xiaoqian Li, Omkar G. Karhade | 2024-11-19 |
| 12125777 | Minimizing package impedance discontinuity through dielectric structure optimizations | Zhiguo Qian, Gang Duan, Jieying Kong, Brandon C. Marin | 2024-10-22 |
| 12062616 | Power delivery for embedded bridge die utilizing trench structures | Zhiguo Qian, Jianyong Xie | 2024-08-13 |
| 12057413 | Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost | Lijiang Wang, Jianyong Xie, Arghya Sain, Xiaohong Jiang, Sujit Sharan | 2024-08-06 |
| 12009320 | Interconnect loss of high density package with magnetic material | Zhiguo Qian, Cemil Geyik, Jiwei Sun, Gang Duan | 2024-06-11 |
| 11983135 | Electrical and optical interfaces at different heights along an edge of a package to increase bandwidth along the edge | Dheeraj Subbareddy, Ankireddy Nalamalpu, Anshuman Thakur, MD Altaf Hossain, Mahesh Kumashikar +3 more | 2024-05-14 |
| 11923308 | Die interconnect structures having bump field and ground plane | Zhiguo Qian | 2024-03-05 |
| 11903138 | Fine feature formation techniques for printed circuit boards | Eric J. Li, Kai Xiao, Gong Ouyang, Zhichao Zhang | 2024-02-13 |
| 11901280 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2024-02-13 |
| 11887932 | Dielectric-filled trench isolation of vias | Zhiguo Qian, Jianyong Xie | 2024-01-30 |
| 11837549 | Power delivery for embedded bridge die utilizing trench structures | Zhiguo Qian, Jianyong Xie | 2023-12-05 |
| 11817391 | Power delivery for embedded bridge die utilizing trench structures | Zhiguo Qian, Jianyong Xie | 2023-11-14 |
| 11810859 | Multi-layered adhesion promotion films | Srinivas V. Pietambaram, Rahul N. Manepalli, Cemil Geyik | 2023-11-07 |
| 11742275 | Ground via clustering for crosstalk mitigation | Zhiguo Qian, Yu Zhang | 2023-08-29 |
| 11737227 | Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket | Zhichao Zhang, Gregorio R. Murtagian, Kuang Liu | 2023-08-22 |
| 11715889 | Slow wave structure for millimeter wave antennas | Zhichao Zhang, Jiwei Sun | 2023-08-01 |
| 11694952 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Zhiguo Qian, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie | 2023-07-04 |
| 11682613 | Package substrates with magnetic build-up layers | Zhiguo Qian, Kaladhar Radhakrishnan | 2023-06-20 |
| 11621227 | Power delivery for embedded bridge die utilizing trench structures | Zhiguo Qian, Jianyong Xie | 2023-04-04 |
| 11574862 | Optimal signal routing performance through dielectric material configuration designs in package substrate | Zhiguo Qian, Gang Duan, Jieying Kong | 2023-02-07 |
| 11545416 | Minimization of insertion loss variation in through-silicon vias (TSVs) | Jianyong Xie, Yidnekachew S. Mekonnen, Zhiguo Qian | 2023-01-03 |
| 11508676 | Density-graded adhesion layer for conductors | Rahul N. Manepalli, Srinivas V. Pietambaram, Cemil Geyik | 2022-11-22 |