Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12433042 | Image sensor structure and manufacturing method thereof | Zhaoyao Zhan, Jing Feng, Ching Hwa Tey | 2025-09-30 |
| D1077846 | Display screen or portion thereof with graphical user interface | — | 2025-06-03 |
| 12190530 | Dense optical flow calculation system and method based on FPGA | Zhe Pan, Jian Wu | 2025-01-07 |
| 12176375 | Image sensor structure including nanowire structure and manufacturing method thereof | Zhaoyao Zhan, Jing Feng, Qianwei Ding, Ching Hwa Tey | 2024-12-24 |
| D1043152 | Recliner chair | — | 2024-09-24 |
| 12094896 | Photosensitive semiconductor device including heterojunction photodiode | Zhaoyao Zhan, Qianwei Ding, Ching Hwa Tey | 2024-09-17 |
| 12080734 | Photosensitive semiconductor device including heterojunction photodiode | Zhaoyao Zhan, Qianwei Ding, Ching Hwa Tey | 2024-09-03 |
| 12057413 | Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost | Lijiang Wang, Jianyong Xie, Arghya Sain, Sujit Sharan, Kemal Aygun | 2024-08-06 |
| 11641000 | Image sensor and manufacturing method thereof | Zhaoyao Zhan, Qianwei Ding, Ching Hwa Tey | 2023-05-02 |
| D981121 | Bike saddle | — | 2023-03-21 |
| D974783 | Bike saddle | — | 2023-01-10 |
| D974058 | Bike saddle | — | 2023-01-03 |
| 11527561 | Photosensitive semiconductor device including top surface photodiode | Zhaoyao Zhan, Qianwei Ding, Ching Hwa Tey | 2022-12-13 |
| D949584 | Bike saddle | — | 2022-04-26 |
| D930375 | Bike saddle | — | 2021-09-14 |
| 11101361 | Gate-all-around (GAA) transistor and method of fabricating the same | Zhaoyao Zhan, Qianwei Ding, Ching Hwa Tey | 2021-08-24 |
| 10909299 | Method for stabilizing bandgap voltage | Wei Pang, Jing Feng, Ching Hwa Tey | 2021-02-02 |
| 9941201 | Magnetically decoupled inductor structures | Nathaniel Wright Unger, Kyung Suk Oh | 2018-04-10 |
| 9842813 | Tranmission line bridge interconnects | Yuanlin Xie | 2017-12-12 |
| 9425149 | Integrated circuit package routing with reduced crosstalk | Jianming Huang, Hong Shi, Jianmin Zhang | 2016-08-23 |
| 9401330 | IC package with non-uniform dielectric layer thickness | Hong Shi, Hui Liu, Yuanlin Xie | 2016-07-26 |
| 9331370 | Multilayer integrated circuit packages with localized air structures | — | 2016-05-03 |
| 9245835 | Integrated circuit package with reduced pad capacitance | Hong Shi | 2016-01-26 |
| 8841561 | High performance PCB | Hong Shi | 2014-09-23 |
| 8723293 | Compensation network using an on-die compensation inductor | Hong Shi | 2014-05-13 |