Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341129 | Substrateless double-sided embedded multi-die interconnect bridge | Biancun Xie, Sujit Sharan, Debendra Mallik, Robert L. Sankman | 2025-06-24 |
| 12218063 | EMIB architecture with dedicated metal layers for improving power delivery | Sujit Sharan, Huang-Ta Chen | 2025-02-04 |
| 12205924 | Semiconductor packages with chiplets coupled to a memory device | Andrew Collins | 2025-01-21 |
| 12062616 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Zhiguo Qian | 2024-08-13 |
| 12057413 | Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost | Lijiang Wang, Arghya Sain, Xiaohong Jiang, Sujit Sharan, Kemal Aygun | 2024-08-06 |
| 12046568 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Andrew Collins, Sujit Sharan | 2024-07-23 |
| 11887932 | Dielectric-filled trench isolation of vias | Kemal Aygun, Zhiguo Qian | 2024-01-30 |
| 11837549 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Zhiguo Qian | 2023-12-05 |
| 11817391 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Zhiguo Qian | 2023-11-14 |
| 11728294 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Andrew Collins, Sujit Sharan | 2023-08-15 |
| 11694952 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Zhiguo Qian, Yidnekachew S. Mekonnen, Zhichao Zhang | 2023-07-04 |
| 11621227 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Zhiguo Qian | 2023-04-04 |
| 11621223 | Interconnect hub for dies | Andrew Collins, Sujit Sharan | 2023-04-04 |
| 11610862 | Semiconductor packages with chiplets coupled to a memory device | Andrew Collins | 2023-03-21 |
| 11545416 | Minimization of insertion loss variation in through-silicon vias (TSVs) | Yidnekachew S. Mekonnen, Zhiguo Qian, Kemal Aygun | 2023-01-03 |
| 11462521 | Multilevel die complex with integrated discrete passive components | Andrew Collins, Sujit Sharan | 2022-10-04 |
| 11456281 | Architecture and processes to enable high capacity memory packages through memory die stacking | Yi Li, Zhiguo Qian, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun +3 more | 2022-09-27 |
| 11387187 | Embedded very high density (VHD) layer | Andrew Collins, Sujit Sharan, Henning Braunisch, Aleksandar Aleksov | 2022-07-12 |
| 11296031 | Dielectric-filled trench isolation of vias | Kemal Aygun, Zhiguo Qian | 2022-04-05 |
| 11276635 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Zhiguo Qian, Yidnekachew S. Mekonnen, Zhichao Zhang | 2022-03-15 |
| 11222837 | Low-inductance current paths for on-package power distributions and methods of assembling same | Andrew Collins, Sujit Sharan | 2022-01-11 |
| 11222848 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Zhiguo Qian | 2022-01-11 |
| 11195805 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Andrew Collins, Sujit Sharan | 2021-12-07 |
| 11114394 | Signal routing carrier | Lijiang Wang, Sujit Sharan, Robert L. Sankman | 2021-09-07 |
| 10950550 | Semiconductor package with through bridge die connections | Zhiguo Qian, Kemal Aygun | 2021-03-16 |