Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11705417 | Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level | Chandra Mohan Jha, Xavier Francois Brun, Jimmin Yao, Mark R. Allen | 2023-07-18 | $21,060,000 |
| 11587843 | Thermal bump networks for integrated circuit device assemblies | Nicholas Neal, Chandra Mohan Jha | 2023-02-21 | $13,703,000 |
| 11456281 | Architecture and processes to enable high capacity memory packages through memory die stacking | Yi Li, Zhiguo Qian, Saikumar Jayaraman, Kemal Aygun, Hector Amador +3 more | 2022-09-27 | $23,391,000 |