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Home › Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level

Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level

US Patent 11705417 · Granted Jul 18, 2023

Estimated economic value: $21,060,000 ⓘ

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