Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic assemblies including interconnects with different solder materials

Microelectronic assemblies including interconnects with different solder materials

US Patent 12412868 · Granted Sep 9, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Substrates having adhesion promotor layers and related methods2025
Reduced bridge structure for a photonic integrated circuit2025
Photonic interconnect and components in glass2025
HBI die architecture with fiducial in street for no metal depopulation in active2025
Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Integrated optical coupler2025
Integrated optical coupler2025
Formation of a reconstituted circuit device using flow of a material by capillar2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025
Faraday rotator interconnect as a through-via configuration in a patch architect2025