| 12412868 |
Microelectronic assemblies including interconnects with different solder materials |
Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade +6 more |
2025-09-09 |
| 12176292 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more |
2024-12-24 |
| 12068172 |
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages |
Tarek A. Ibrahim, Rahul N. Manepalli, Wei-Lun Kane Jen, Steve Cho, Javier Soto Gonzalez |
2024-08-20 |
| 11817390 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more |
2023-11-14 |
| 11688692 |
Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias |
Praneeth Akkinepally, Frank Truong, Robert Alan May |
2023-06-27 |
| 11640942 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more |
2023-05-02 |
| 11527484 |
Dielectric filler material in conductive material that functions as fiducial for an electronic device |
Jesse C. Jones, Gang Duan, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan |
2022-12-13 |
| 11521931 |
Microelectronic structures including bridges |
Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Bai Nie, Gang Duan +2 more |
2022-12-06 |
| 11462432 |
Dual side de-bonding in component carriers using photoablation |
Frank Truong, Praneeth Akkinepally, Chelsea M. Groves, Whitney Bryks, Brandon C. Marin |
2022-10-04 |
| 11302643 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more |
2022-04-12 |
| 11233009 |
Embedded multi-die interconnect bridge having a molded region with through-mold vias |
Praneeth Akkinepally, Frank Truong, Robert Alan May |
2022-01-25 |
| 10847471 |
Dielectric filler material in conductive material that functions as fiducial for an electronic device |
Jesse C. Jones, Gang Duan, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan |
2020-11-24 |
| 8597577 |
Swept-frequency semiconductor laser coupled to microfabricated biomolecular sensor and methods related thereto |
Richard C. Flagan, Amnon Yariv, Naresh Satyan, Jacob Benjamin Sendowski, Arseny Vasilyev |
2013-12-03 |
