Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade +6 more | 2025-09-09 |
| 12176292 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more | 2024-12-24 |
| 12068172 | Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages | Tarek A. Ibrahim, Rahul N. Manepalli, Wei-Lun Kane Jen, Steve Cho, Javier Soto Gonzalez | 2024-08-20 |
| 11817390 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more | 2023-11-14 |
| 11688692 | Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias | Praneeth Akkinepally, Frank Truong, Robert Alan May | 2023-06-27 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more | 2023-05-02 |
| 11527484 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Jesse C. Jones, Gang Duan, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan | 2022-12-13 |
| 11521931 | Microelectronic structures including bridges | Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Bai Nie, Gang Duan +2 more | 2022-12-06 |
| 11462432 | Dual side de-bonding in component carriers using photoablation | Frank Truong, Praneeth Akkinepally, Chelsea M. Groves, Whitney Bryks, Brandon C. Marin | 2022-10-04 |
| 11302643 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more | 2022-04-12 |
| 11233009 | Embedded multi-die interconnect bridge having a molded region with through-mold vias | Praneeth Akkinepally, Frank Truong, Robert Alan May | 2022-01-25 |
| 10847471 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Jesse C. Jones, Gang Duan, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan | 2020-11-24 |
| 8597577 | Swept-frequency semiconductor laser coupled to microfabricated biomolecular sensor and methods related thereto | Richard C. Flagan, Amnon Yariv, Naresh Satyan, Jacob Benjamin Sendowski, Arseny Vasilyev | 2013-12-03 |