Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
JG

Jason M. Gamba — 13 Patents

Intel: 12 patents #3,451 of 30,777Top 15%
Caltech: 1 patents #2,143 of 4,321Top 50%
Gilbert, AZ: #170 of 1,739 inventorsTop 10%
Arizona: #2,773 of 32,909 inventorsTop 9%
Overall (All Time): #362,438 of 4,157,543Top 9%
13 Patents All Time
Jason M. Gamba has been granted 13 US patents while listed as an inventor at Intel. The first was granted in 2013 and the most recent in September 2025. Jason M. Gamba ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Jason M. Gamba in Gilbert, AZ, US.

Patents per Year

Patents granted per year, 2013 to 2025Bar chart with a peak of 5 patents in 2022.peak 52013: 1 patents20132020: 1 patents20202022: 5 patents20222023: 3 patents20232024: 2 patents20242025: 1 patents2025

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12412868 Microelectronic assemblies including interconnects with different solder materials Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade +6 more 2025-09-09
12176292 Microelectronic component having molded regions with through-mold vias Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more 2024-12-24 $17,261,000
12068172 Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages Tarek A. Ibrahim, Rahul N. Manepalli, Wei-Lun Kane Jen, Steve Cho, Javier Soto Gonzalez 2024-08-20 $20,163,000
11817390 Microelectronic component having molded regions with through-mold vias Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more 2023-11-14 $31,444,000
11688692 Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias Praneeth Akkinepally, Frank Truong, Robert Alan May 2023-06-27 $18,721,000
11640942 Microelectronic component having molded regions with through-mold vias Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more 2023-05-02 $21,235,000
11527484 Dielectric filler material in conductive material that functions as fiducial for an electronic device Jesse C. Jones, Gang Duan, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan 2022-12-13 $11,573,000
11521931 Microelectronic structures including bridges Nitin A. Deshpande, Mohit Bhatia, Omkar G. Karhade, Bai Nie, Gang Duan +2 more 2022-12-06 $14,727,000
11462432 Dual side de-bonding in component carriers using photoablation Frank Truong, Praneeth Akkinepally, Chelsea M. Groves, Whitney Bryks, Brandon C. Marin 2022-10-04 $13,460,000
11302643 Microelectronic component having molded regions with through-mold vias Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more 2022-04-12 $16,909,000
11233009 Embedded multi-die interconnect bridge having a molded region with through-mold vias Praneeth Akkinepally, Frank Truong, Robert Alan May 2022-01-25 $21,146,000
10847471 Dielectric filler material in conductive material that functions as fiducial for an electronic device Jesse C. Jones, Gang Duan, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan 2020-11-24 $25,522,000
8597577 Swept-frequency semiconductor laser coupled to microfabricated biomolecular sensor and methods related thereto Richard C. Flagan, Amnon Yariv, Naresh Satyan, Jacob Benjamin Sendowski, Arseny Vasilyev 2013-12-03