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Jesse C. Jones — 10 Patents

Intel: 10 patents #4,072 of 30,777Top 15%
Chandler, AZ: #579 of 3,331 inventorsTop 20%
Arizona: #3,693 of 32,909 inventorsTop 15%
Overall (All Time): #481,000 of 4,157,543Top 15%
10 Patents All Time
Jesse C. Jones has been granted 10 US patents while listed as an inventor at Intel. The first was granted in 2020 and the most recent in July 2025. Jesse C. Jones ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Jesse C. Jones in Chandler, AZ, US.

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12354963 Lithographic cavity formation to enable EMIB bump pitch scaling Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more 2025-07-08
12334443 Lithographic cavity formation to enable EMIB bump pitch scaling Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more 2025-06-17
12087700 Embedded die microelectronic device with molded component Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Yosuke Kanaoka, Dilan Seneviratne 2024-09-10 $16,964,000
11929330 Lithographic cavity formation to enable EMIB bump pitch scaling Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more 2024-03-12 $37,196,000
11923312 Patternable die attach materials and processes for patterning Bai Nie, Gang Duan, Srinivas V. Pietambaram, Yosuke Kanaoka, Hongxia Feng +10 more 2024-03-05 $29,696,000
11527484 Dielectric filler material in conductive material that functions as fiducial for an electronic device Gang Duan, Jason M. Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan 2022-12-13 $11,573,000
11322444 Lithographic cavity formation to enable EMIB bump pitch scaling Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more 2022-05-03 $16,346,000
11081448 Embedded die microelectronic device with molded component Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Yosuke Kanaoka, Dilan Seneviratne 2021-08-03 $25,424,000
11062933 Die placement and coupling apparatus Gang Duan, Yosuke Kanaoka, Rahul N. Manepalli 2021-07-13 $34,958,000
10847471 Dielectric filler material in conductive material that functions as fiducial for an electronic device Gang Duan, Jason M. Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan 2020-11-24 $25,522,000

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