Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354963 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more | 2025-07-08 |
| 12334443 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more | 2025-06-17 |
| 12087700 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Yosuke Kanaoka, Dilan Seneviratne | 2024-09-10 |
| 11929330 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more | 2024-03-12 |
| 11923312 | Patternable die attach materials and processes for patterning | Bai Nie, Gang Duan, Srinivas V. Pietambaram, Yosuke Kanaoka, Hongxia Feng +10 more | 2024-03-05 |
| 11527484 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Gang Duan, Jason M. Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan | 2022-12-13 |
| 11322444 | Lithographic cavity formation to enable EMIB bump pitch scaling | Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie +1 more | 2022-05-03 |
| 11081448 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Yosuke Kanaoka, Dilan Seneviratne | 2021-08-03 |
| 11062933 | Die placement and coupling apparatus | Gang Duan, Yosuke Kanaoka, Rahul N. Manepalli | 2021-07-13 |
| 10847471 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Gang Duan, Jason M. Gamba, Yosuke Kanaoka, Rahul N. Manepalli, Vishal Shajan | 2020-11-24 |