Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394682 | Organic passivation for fine pitch architectures | — | 2025-08-19 |
| 12087700 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Rahul N. Manepalli, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne | 2024-09-10 |
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Brandon C. Marin, Andrew J. Brown, Rahul Jain, Dilan Seneviratne, Frank Truong | 2023-08-22 |
| 11688692 | Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias | Frank Truong, Jason M. Gamba, Robert Alan May | 2023-06-27 |
| 11652071 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Jeremy Ecton | 2023-05-16 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more | 2023-02-07 |
| 11571876 | Dielectric film with pressure sensitive microcapsules of adhesion promoter | Frank Truong, Dilan Seneviratne | 2023-02-07 |
| 11462432 | Dual side de-bonding in component carriers using photoablation | Frank Truong, Chelsea M. Groves, Whitney Bryks, Jason M. Gamba, Brandon C. Marin | 2022-10-04 |
| 11348865 | Electronic device including a substrate having interconnects | Jieying Kong, Frank Truong | 2022-05-31 |
| 11296186 | Package-integrated vertical capacitors and methods of assembling same | Brandon C. Marin, Whitney Bryks, Dilan Seneviratne, Frank Truong | 2022-04-05 |
| 11233009 | Embedded multi-die interconnect bridge having a molded region with through-mold vias | Frank Truong, Jason M. Gamba, Robert Alan May | 2022-01-25 |
| 11081448 | Embedded die microelectronic device with molded component | Srinivas V. Pietambaram, Rahul N. Manepalli, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne | 2021-08-03 |
| 10985080 | Electronic package that includes lamination layer | Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne +3 more | 2021-04-20 |
| 10923443 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Jeremy Ecton | 2021-02-16 |
| 10546916 | Package-integrated vertical capacitors and methods of assembling same | Brandon C. Marin, Whitney Bryks, Dilan Seneviratne, Frank Truong | 2020-01-28 |
| 10410940 | Semiconductor package with cavity | — | 2019-09-10 |
| 10068776 | Raster-planarized substrate interlayers and methods of planarizing same | Frank Truong, Shruti R. Jaywant, Dilan Seneviratne | 2018-09-04 |