| 12394682 |
Organic passivation for fine pitch architectures |
— |
2025-08-19 |
|
| 12087700 |
Embedded die microelectronic device with molded component |
Srinivas V. Pietambaram, Rahul N. Manepalli, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne |
2024-09-10 |
$16,964,000 |
| 11737208 |
Microelectronic assemblies having conductive structures with different thicknesses |
Brandon C. Marin, Andrew J. Brown, Rahul Jain, Dilan Seneviratne, Frank Truong |
2023-08-22 |
$16,803,000 |
| 11688692 |
Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias |
Frank Truong, Jason M. Gamba, Robert Alan May |
2023-06-27 |
$18,721,000 |
| 11652071 |
Electronic device package including a capacitor |
Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Jeremy Ecton |
2023-05-16 |
$11,130,000 |
| 11574874 |
Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more |
2023-02-07 |
$11,877,000 |
| 11571876 |
Dielectric film with pressure sensitive microcapsules of adhesion promoter |
Frank Truong, Dilan Seneviratne |
2023-02-07 |
$11,877,000 |
| 11462432 |
Dual side de-bonding in component carriers using photoablation |
Frank Truong, Chelsea M. Groves, Whitney Bryks, Jason M. Gamba, Brandon C. Marin |
2022-10-04 |
$13,460,000 |
| 11348865 |
Electronic device including a substrate having interconnects |
Jieying Kong, Frank Truong |
2022-05-31 |
$16,893,000 |
| 11296186 |
Package-integrated vertical capacitors and methods of assembling same |
Brandon C. Marin, Whitney Bryks, Dilan Seneviratne, Frank Truong |
2022-04-05 |
$18,322,000 |
| 11233009 |
Embedded multi-die interconnect bridge having a molded region with through-mold vias |
Frank Truong, Jason M. Gamba, Robert Alan May |
2022-01-25 |
$21,146,000 |
| 11081448 |
Embedded die microelectronic device with molded component |
Srinivas V. Pietambaram, Rahul N. Manepalli, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne |
2021-08-03 |
$25,424,000 |
| 10985080 |
Electronic package that includes lamination layer |
Pramod Malatkar, Kyle Yazzie, Naga Sivakumar Yagnamurthy, Richard J. Harries, Dilan Seneviratne +3 more |
2021-04-20 |
$53,056,000 |
| 10923443 |
Electronic device package including a capacitor |
Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Jeremy Ecton |
2021-02-16 |
$35,223,000 |
| 10546916 |
Package-integrated vertical capacitors and methods of assembling same |
Brandon C. Marin, Whitney Bryks, Dilan Seneviratne, Frank Truong |
2020-01-28 |
$38,246,000 |
| 10410940 |
Semiconductor package with cavity |
— |
2019-09-10 |
$24,704,000 |
| 10068776 |
Raster-planarized substrate interlayers and methods of planarizing same |
Frank Truong, Shruti R. Jaywant, Dilan Seneviratne |
2018-09-04 |
$19,235,000 |
