Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191240 | Hybrid glass core for wafer level and panel level packaging applications | Srinivas V. Pietambaram, Gang Duan | 2025-01-07 |
| 12125777 | Minimizing package impedance discontinuity through dielectric structure optimizations | Zhiguo Qian, Gang Duan, Kemal Aygun, Brandon C. Marin | 2024-10-22 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng, Tarek A. Ibrahim +9 more | 2024-07-09 |
| 11780210 | Glass dielectric layer with patterning | Gang Duan, Srinivas V. Pietambaram, Patrick QUACH, Dilan Seneviratne | 2023-10-10 |
| 11574862 | Optimal signal routing performance through dielectric material configuration designs in package substrate | Zhiguo Qian, Gang Duan, Kemal Aygun | 2023-02-07 |
| 11348865 | Electronic device including a substrate having interconnects | Praneeth Akkinepally, Frank Truong | 2022-05-31 |