| 12482733 |
Ground via clustering for crosstalk mitigation |
Kemal Aygun, Yuan Zhang |
2025-11-25 |
|
| 12347788 |
Glass substrates having signal shielding for use with semiconductor packages and related methods |
Kristof Darmawikarta, Srinivas V. Pietambaram, Kemal Aygun, Telesphor Kamgaing, Jiwei Sun |
2025-07-01 |
|
| 12266682 |
Capacitors and resistors at direct bonding interfaces in microelectronic assemblies |
Adel A. Elsherbini, Mohammad Enamul Kabir, Gerald Pasdast, Kimin Jun, Shawna M. Liff +3 more |
2025-04-01 |
|
| 12255130 |
Airgap structures for high speed signal integrity |
Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo +4 more |
2025-03-18 |
|
| 12159840 |
Scalable and interoperable PHYLESS die-to-die IO solution |
Gerald Pasdast, Juan Zeng, Peipei Wang, Ahmad Siddiqui, Lakshmipriya Seshan |
2024-12-03 |
$28,395,000 |
| 12125777 |
Minimizing package impedance discontinuity through dielectric structure optimizations |
Gang Duan, Kemal Aygun, Jieying Kong, Brandon C. Marin |
2024-10-22 |
$18,859,000 |
| 12107060 |
Microelectronic assemblies with inductors in direct bonding regions |
Adel A. Elsherbini, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then, Kimin Jun +5 more |
2024-10-01 |
$20,560,000 |
| 12100662 |
Power-forwarding bridge for inter-chip data signal transfer |
Gerald Pasdast, Peipei Wang, Daniel Scott Krueger, Edward A. Burton |
2024-09-24 |
$33,787,000 |
| 12062616 |
Power delivery for embedded bridge die utilizing trench structures |
Kemal Aygun, Jianyong Xie |
2024-08-13 |
$26,861,000 |
| 12033930 |
Selectively roughened copper architectures for low insertion loss conductive features |
Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more |
2024-07-09 |
$24,938,000 |
| 12009320 |
Interconnect loss of high density package with magnetic material |
Cemil Geyik, Jiwei Sun, Gang Duan, Kemal Aygun |
2024-06-11 |
$21,221,000 |
| 11984439 |
Microelectronic assemblies |
Adel A. Elsherbini, Georgios Dogiamis, Shawna M. Liff, Johanna M. Swan |
2024-05-14 |
$33,809,000 |
| 11923308 |
Die interconnect structures having bump field and ground plane |
Kemal Aygun |
2024-03-05 |
$29,696,000 |
| 11901280 |
Ground via clustering for crosstalk mitigation |
Kemal Aygun, Yu Zhang |
2024-02-13 |
$18,546,000 |
| 11887932 |
Dielectric-filled trench isolation of vias |
Kemal Aygun, Jianyong Xie |
2024-01-30 |
$30,721,000 |
| 11837549 |
Power delivery for embedded bridge die utilizing trench structures |
Kemal Aygun, Jianyong Xie |
2023-12-05 |
$33,749,000 |
| 11817391 |
Power delivery for embedded bridge die utilizing trench structures |
Kemal Aygun, Jianyong Xie |
2023-11-14 |
$31,444,000 |
| 11742275 |
Ground via clustering for crosstalk mitigation |
Kemal Aygun, Yu Zhang |
2023-08-29 |
$19,273,000 |
| 11694952 |
Horizontal pitch translation using embedded bridge dies |
Sujit Sharan, Kemal Aygun, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie |
2023-07-04 |
|
| 11682613 |
Package substrates with magnetic build-up layers |
Kaladhar Radhakrishnan, Kemal Aygun |
2023-06-20 |
$18,411,000 |
| 11621227 |
Power delivery for embedded bridge die utilizing trench structures |
Kemal Aygun, Jianyong Xie |
2023-04-04 |
$21,090,000 |
| 11574862 |
Optimal signal routing performance through dielectric material configuration designs in package substrate |
Gang Duan, Kemal Aygun, Jieying Kong |
2023-02-07 |
$11,877,000 |
| 11545416 |
Minimization of insertion loss variation in through-silicon vias (TSVs) |
Jianyong Xie, Yidnekachew S. Mekonnen, Kemal Aygun |
2023-01-03 |
$15,575,000 |
| 11456281 |
Architecture and processes to enable high capacity memory packages through memory die stacking |
Yi Li, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun, Hector Amador +3 more |
2022-09-27 |
$23,391,000 |
| 11450560 |
Microelectronic assemblies having magnetic core inductors |
Krishna Bharath, Adel A. Elsherbini, Shawna M. Liff, Kaladhar Radhakrishnan, Johanna M. Swan |
2022-09-20 |
$15,654,000 |
