Issued Patents All Time
Showing 25 most recent of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347788 | Glass substrates having signal shielding for use with semiconductor packages and related methods | Kristof Darmawikarta, Srinivas V. Pietambaram, Kemal Aygun, Telesphor Kamgaing, Jiwei Sun | 2025-07-01 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Adel A. Elsherbini, Mohammad Enamul Kabir, Gerald Pasdast, Kimin Jun, Shawna M. Liff +3 more | 2025-04-01 |
| 12255130 | Airgap structures for high speed signal integrity | Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo +4 more | 2025-03-18 |
| 12159840 | Scalable and interoperable PHYLESS die-to-die IO solution | Gerald Pasdast, Juan Zeng, Peipei Wang, Ahmad Siddiqui, Lakshmipriya Seshan | 2024-12-03 |
| 12125777 | Minimizing package impedance discontinuity through dielectric structure optimizations | Gang Duan, Kemal Aygun, Jieying Kong, Brandon C. Marin | 2024-10-22 |
| 12107060 | Microelectronic assemblies with inductors in direct bonding regions | Adel A. Elsherbini, Gerald Pasdast, Mohammad Enamul Kabir, Han Wui Then, Kimin Jun +5 more | 2024-10-01 |
| 12100662 | Power-forwarding bridge for inter-chip data signal transfer | Gerald Pasdast, Peipei Wang, Daniel Scott Krueger, Edward A. Burton | 2024-09-24 |
| 12062616 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Jianyong Xie | 2024-08-13 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |
| 12009320 | Interconnect loss of high density package with magnetic material | Cemil Geyik, Jiwei Sun, Gang Duan, Kemal Aygun | 2024-06-11 |
| 11984439 | Microelectronic assemblies | Adel A. Elsherbini, Georgios Dogiamis, Shawna M. Liff, Johanna M. Swan | 2024-05-14 |
| 11923308 | Die interconnect structures having bump field and ground plane | Kemal Aygun | 2024-03-05 |
| 11901280 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2024-02-13 |
| 11887932 | Dielectric-filled trench isolation of vias | Kemal Aygun, Jianyong Xie | 2024-01-30 |
| 11837549 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Jianyong Xie | 2023-12-05 |
| 11817391 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Jianyong Xie | 2023-11-14 |
| 11742275 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2023-08-29 |
| 11694952 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie | 2023-07-04 |
| 11682613 | Package substrates with magnetic build-up layers | Kaladhar Radhakrishnan, Kemal Aygun | 2023-06-20 |
| 11621227 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Jianyong Xie | 2023-04-04 |
| 11574862 | Optimal signal routing performance through dielectric material configuration designs in package substrate | Gang Duan, Kemal Aygun, Jieying Kong | 2023-02-07 |
| 11545416 | Minimization of insertion loss variation in through-silicon vias (TSVs) | Jianyong Xie, Yidnekachew S. Mekonnen, Kemal Aygun | 2023-01-03 |
| 11456281 | Architecture and processes to enable high capacity memory packages through memory die stacking | Yi Li, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun, Hector Amador +3 more | 2022-09-27 |
| 11450613 | Integrated circuit package with test circuitry for testing a channel between dies | Mayue Xie, Jong-Ru Guo, Zuoguo Wu | 2022-09-20 |
| 11450560 | Microelectronic assemblies having magnetic core inductors | Krishna Bharath, Adel A. Elsherbini, Shawna M. Liff, Kaladhar Radhakrishnan, Johanna M. Swan | 2022-09-20 |