Yu Zhang — 21 Patents at Intel

Yu Zhang has been granted 21 US patents while listed as an inventor at Intel. The first was granted in 2016 and the most recent in March 2025. Yu Zhang ranks #201,324 of 4,157,543 US inventors in our database (top 4.8%). Patent records list Yu Zhang in Beijing, AZ, CN.

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12253955	Methods, systems, articles of manufacture and apparatus to control address space isolation in a virtual machine	Jun Tian, Kun Tian	2025-03-18
11971827	Methods, systems, articles of manufacture and apparatus to control address space isolation in a virtual machine	Jun Tian, Kun Tian	2024-04-30	$26,151,000
11960422	Direct memory access tracking for pass-through devices in virtualized environments	Kun Tian, Yan Zhao	2024-04-16	$37,256,000
11901280	Ground via clustering for crosstalk mitigation	Zhiguo Qian, Kemal Aygun	2024-02-13	$18,546,000
11742275	Ground via clustering for crosstalk mitigation	Zhiguo Qian, Kemal Aygun	2023-08-29	$19,273,000
11598804	Debug tool for test instruments coupled to a device under test	Jesse Armagost, Nathan S. Blackwell, Matthew Boelter, Geoffrey Oliver Kelly, James Neeb +2 more	2023-03-07	$16,825,000
11244890	Ground via clustering for crosstalk mitigation	Zhiguo Qian, Kemal Aygun	2022-02-08	$27,206,000
11031341	Side mounted interconnect bridges	Md Altai Hossain, Kevin J. Doran, Zhiguo Qian	2021-06-08	$26,946,000
10886171	Rlink-on-die interconnect features to enable signaling	Kemal Aygun	2021-01-05	$27,050,000
10854539	Ground via clustering for crosstalk mitigation	Zhiguo Qian, Kemal Aygun	2020-12-01	$25,476,000
10784204	Rlink—die to die channel interconnect configurations to improve signaling	Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more	2020-09-22	$34,575,000
10778600	Adaptive workload distribution for network of video processors	Huifeng Le, Wenjian SHAO, Shao-Wen Yang, Heng Juen Han, Xiaowen Zhang	2020-09-15	$34,212,000
10607951	Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices	Gabriel Regalado Silva, Zhiguo Qian, Kemal Aygun	2020-03-31	$34,068,000
10580734	Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices	Gabriel Regalado Silva, Zhiguo Qian, Kemal Aygun	2020-03-03	$18,388,000
10453795	Microprocessor package with first level die bump ground webbing structure	Mathew J. Manusharow, Kemal Aygun, Mohiuddin M. Mazumder	2019-10-22	$16,310,000
10396022	Ground via clustering for crosstalk mitigation	Zhiguo Qian, Kemal Aygun	2019-08-27	$17,353,000
10396036	Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices	Zhiguo Qian, Kemal Aygun, Yidnekachew S. Mekonnen, Gregorio R. Murtagian, Sanka Ganesan +2 more	2019-08-27	$17,353,000
10026682	Ground via clustering for crosstalk mitigation	Zhiguo Qian, Kemal Aygun	2018-07-17	$22,904,000
9935063	Rlink-on-die inductor structures to improve signaling	Jihwan Kim, Ajay Balankutty, Anupriya Sriramulu, Md. Mohiuddin Mazumder, Frank O'Mahony +2 more	2018-04-03	$16,515,000
9515017	Ground via clustering for crosstalk mitigation	Zhiguo Qian, Kemal Aygun	2016-12-06	$8,381,000
9230900	Ground via clustering for crosstalk mitigation	Zhiguo Qian, Kemal Aygun	2016-01-05	$11,513,000

Yu Zhang — 21 Patents

Issued Patents All Time

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