YZ

Yu Zhang

IN Intel: 21 patents #1,904 of 30,777Top 7%
Overall (All Time): #200,944 of 4,157,543Top 5%
21
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12253955 Methods, systems, articles of manufacture and apparatus to control address space isolation in a virtual machine Jun Tian, Kun Tian 2025-03-18
11971827 Methods, systems, articles of manufacture and apparatus to control address space isolation in a virtual machine Jun Tian, Kun Tian 2024-04-30
11960422 Direct memory access tracking for pass-through devices in virtualized environments Kun Tian, Yan Zhao 2024-04-16
11901280 Ground via clustering for crosstalk mitigation Zhiguo Qian, Kemal Aygun 2024-02-13
11742275 Ground via clustering for crosstalk mitigation Zhiguo Qian, Kemal Aygun 2023-08-29
11598804 Debug tool for test instruments coupled to a device under test Jesse Armagost, Nathan S. Blackwell, Matthew Boelter, Geoffrey Oliver Kelly, James Neeb +2 more 2023-03-07
11244890 Ground via clustering for crosstalk mitigation Zhiguo Qian, Kemal Aygun 2022-02-08
11031341 Side mounted interconnect bridges Md Altai Hossain, Kevin J. Doran, Zhiguo Qian 2021-06-08
10886171 Rlink-on-die interconnect features to enable signaling Kemal Aygun 2021-01-05
10854539 Ground via clustering for crosstalk mitigation Zhiguo Qian, Kemal Aygun 2020-12-01
10784204 Rlink—die to die channel interconnect configurations to improve signaling Kemal Aygun, Richard J. Dischler, Jeff C. Morriss, Zhiguo Qian, Wilfred Gomes +7 more 2020-09-22
10778600 Adaptive workload distribution for network of video processors Huifeng Le, Wenjian SHAO, Shao-Wen Yang, Heng Juen Han, Xiaowen Zhang 2020-09-15
10607951 Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices Gabriel Regalado Silva, Zhiguo Qian, Kemal Aygun 2020-03-31
10580734 Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices Gabriel Regalado Silva, Zhiguo Qian, Kemal Aygun 2020-03-03
10453795 Microprocessor package with first level die bump ground webbing structure Mathew J. Manusharow, Kemal Aygun, Mohiuddin M. Mazumder 2019-10-22
10396022 Ground via clustering for crosstalk mitigation Zhiguo Qian, Kemal Aygun 2019-08-27
10396036 Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices Zhiguo Qian, Kemal Aygun, Yidnekachew S. Mekonnen, Gregorio R. Murtagian, Sanka Ganesan +2 more 2019-08-27
10026682 Ground via clustering for crosstalk mitigation Zhiguo Qian, Kemal Aygun 2018-07-17
9935063 Rlink-on-die inductor structures to improve signaling Jihwan Kim, Ajay Balankutty, Anupriya Sriramulu, Md. Mohiuddin Mazumder, Frank O'Mahony +2 more 2018-04-03
9515017 Ground via clustering for crosstalk mitigation Zhiguo Qian, Kemal Aygun 2016-12-06
9230900 Ground via clustering for crosstalk mitigation Zhiguo Qian, Kemal Aygun 2016-01-05