Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Rlink-on-die inductor structures to improve signaling

Rlink-on-die inductor structures to improve signaling

US Patent 9935063 · Granted Apr 3, 2018

Estimated economic value: $16,515,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ground via clustering for crosstalk mitigation2025
Control circuit and control method of bistable permanent magnet mechanism2025
Heterogenous socket contact for electrical and mechanical performance scaling in2025
Link initialization training and bring up for die-to-die interconnect2025
Extending multichip package link off package2025
Substrate treatment apparatus and semiconductor device manufacturing method usin2025
Skew detection and compensation for high speed I/O links2025
Electronic device comprising rollable display2025
Clock-gating in die-to-die (D2D) interconnects2025
Compliance and debug testing of a die-to-die interconnect2025
Vehicle seat control system and method therefor2025
Glass substrates having signal shielding for use with semiconductor packages and2025