Issued Patents All Time
Showing 25 most recent of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12405912 | Link initialization training and bring up for die-to-die interconnect | Narasimha Lanka, Lakshmipriya Seshan, Swadesh Choudhary, Debendra Das Sharma, Gerald Pasdast | 2025-09-02 |
| 12386768 | Extending multichip package link off package | Debendra Das Sharma, Mahesh Wagh, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2025-08-12 |
| 12372574 | Skew detection and compensation for high speed I/O links | Jong-Ru Guo, Jingbo Li, Xiaoning Ye, Howard L. Heck | 2025-07-29 |
| 12362306 | Clock-gating in die-to-die (D2D) interconnects | Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Gerald Pasdast, Swadesh Choudhary | 2025-07-15 |
| 12353305 | Compliance and debug testing of a die-to-die interconnect | Swadesh Choudhary, Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Gerald Pasdast | 2025-07-08 |
| 12332826 | Die-to-die interconnect | Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Lakshmipriya Seshan, Gerald Pasdast | 2025-06-17 |
| 12321305 | Sideband interface for die-to-die interconnects | Narasimha Lanka, Swadesh Choudhary, Debendra Das Sharma, Lakshmipriya Seshan, Gerald Pasdast | 2025-06-03 |
| 12316343 | PHY-based retry techniques for die-to-die interfaces | Narasimha Lanka, Lakshmipriya Seshan, Debendra Das Sharma, Gerald Pasdast | 2025-05-27 |
| 12283994 | Apparatus, method, and system for performing error correction based on laser power setting | Ling Liao, David Chak Wang Hui | 2025-04-22 |
| 12196807 | Near field wireless communication system for mother to package and package to package sideband digital communication | Zhen Zhou, Renzhi Liu, Jong-Ru Guo, Kenneth P. Foust, Jason A. Mix +2 more | 2025-01-14 |
| 12155474 | Characterizing and margining multi-voltage signal encoding for interconnects | Debendra Das Sharma, Per E. Fornberg, Tal Israeli | 2024-11-26 |
| 12117960 | Approximate data bus inversion technique for latency sensitive applications | Narasimha Lanka, Lakshmipriya Seshan, Gerald Pasdast | 2024-10-15 |
| 11797378 | Multichip package link error detection | Venkatraman Iyer, Robert G. Blankenship, Mahesh Wagh | 2023-10-24 |
| 11632130 | PCI express enhancements | Debendra Das Sharma, Md. Mohiuddin Mazumder, Subas Bastola, Kai Xiao | 2023-04-18 |
| 11599497 | High performance interconnect | Debendra Das Sharma, Mohiuddin M. Mazumder, Jong-Ru Guo, Anupriya Sriramulu, Narasimha Lanka +2 more | 2023-03-07 |
| 11450613 | Integrated circuit package with test circuitry for testing a channel between dies | Mayue Xie, Jong-Ru Guo, Zhiguo Qian | 2022-09-20 |
| 11386033 | Extending multichip package link off package | Debendra Das Sharma, Mahesh Wagh, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2022-07-12 |
| 11307928 | Multichip package link error detection | Venkatraman Iyer, Robert G. Blankenship, Mahesh Wagh | 2022-04-19 |
| 11283466 | PCI express enhancements | Debendra Das Sharma, Md. Mohiuddin Mazumder, Subas Bastola, Kai Xiao | 2022-03-22 |
| 11116072 | Discrete circuit having cross-talk noise cancellation circuitry and method thereof | Jun Liao, Zhen Zhou, James A. McCall, Jong-Ru Guo, Xiang Li +1 more | 2021-09-07 |
| 11113225 | Extending multichip package link off package | Debendra Das Sharma, Mahesh Wagh, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2021-09-07 |
| 11061761 | Multichip package link error detection | Venkatraman Iyer, Robert G. Blankenship, Mahesh Wagh | 2021-07-13 |
| 11043965 | PCI express enhancements | Debendra Das Sharma, Md. Mohiuddin Mazumder, Subas Bastola, Kai Xiao | 2021-06-22 |
| 11003610 | Multichip package link | Mahesh Wagh, Debendra Das Sharma, Gerald Pasdast, Ananthan Ayyasamy, Xiaobel Li +2 more | 2021-05-11 |
| 10965047 | Connector with active circuit | Jong-Ru Guo, Yunhui Chu, Jun Liao, Kai Xiao, Jingbo Li +7 more | 2021-03-30 |