Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12386768 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mahesh Wagh, Venkatraman Iyer, Jeff C. Morriss | 2025-08-12 |
| 11599497 | High performance interconnect | Zuoguo Wu, Debendra Das Sharma, Jong-Ru Guo, Anupriya Sriramulu, Narasimha Lanka +2 more | 2023-03-07 |
| 11386033 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mahesh Wagh, Venkatraman Iyer, Jeff C. Morriss | 2022-07-12 |
| 11113225 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mahesh Wagh, Venkatraman Iyer, Jeff C. Morriss | 2021-09-07 |
| 10789201 | High performance interconnect | Zuoguo Wu, Debendra Das Sharma, Jong-Ru Guo, Anupriya Sriramulu, Narasimha Lanka +2 more | 2020-09-29 |
| 10678736 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mahesh Wagh, Venkatraman Iyer, Jeff C. Morriss | 2020-06-09 |
| 10453795 | Microprocessor package with first level die bump ground webbing structure | Yu Zhang, Mathew J. Manusharow, Kemal Aygun | 2019-10-22 |
| 8508947 | Flex cable and method for making the same | Sanka Ganesan, Zhichao Zhang, Kemal Aygun | 2013-08-13 |
| 7525723 | Circuit board-to-circuit board connectors having electro-optic modulators | Sanjay Dabral, Hai Feng Liu, Larry R. Tate | 2009-04-28 |
| 7402048 | Technique for blind-mating daughtercard to mainboard | Pascal Meier, Michael W. Leddige, Mark B. Trobough, Alok Tripathi, Ven Holalkere | 2008-07-22 |
| 7325208 | Method, apparatus and system for inductance modeling in an electrical configuration | Sourav Chakravarty, Yaakov Ben-Noon, Eli Chiprout, Dmitry Messerman | 2008-01-29 |
| 7289945 | Analyzing interconnect structures | Dan Jiao, Changhong Dai | 2007-10-30 |
| 6191472 | Hole geometry of a semiconductor package substrate | — | 2001-02-20 |