| 10198333 |
Test, validation, and debug architecture |
Keshavan Tiruvallur, Chinna Prudvi, Christian Iovin, David W. Grawrock, Jay Nejedlo +37 more |
2019-02-05 |
| 9418906 |
Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates |
Christopher S. Baldwin |
2016-08-16 |
| 9111927 |
Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates |
Christopher S. Baldwin |
2015-08-18 |
| 8834184 |
Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates |
Christopher S. Baldwin |
2014-09-16 |
| 8212350 |
Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates |
Christopher S. Baldwin |
2012-07-03 |
| 7641481 |
Non-intrusive interposer for accessing integrated circuit package signals |
— |
2010-01-05 |
| 7402048 |
Technique for blind-mating daughtercard to mainboard |
Pascal Meier, Michael W. Leddige, Mohiuddin M. Mazumder, Alok Tripathi, Ven Holalkere |
2008-07-22 |
| 7344318 |
Optical interconnect with passive optical alignment |
Daoqiang Lu, Henning Braunisch, Bram Leader |
2008-03-18 |
| 7278858 |
Socket with integral, retractable socket contact protector |
— |
2007-10-09 |
| 7248481 |
Circuit board and system with a multi-portion socket |
— |
2007-07-24 |
| 7248036 |
Method and apparatus to probe bus signals using repeaters |
Richard Glass |
2007-07-24 |
| 6971887 |
Multi-portion socket and related apparatuses |
— |
2005-12-06 |
| 6539614 |
Apparatus for producing high efficiency heat sinks |
— |
2003-04-01 |
| 6374491 |
Method and apparatus for producing high efficiency heat sinks |
— |
2002-04-23 |
| 6347946 |
Pin grid array socket |
Michael Baker |
2002-02-19 |
| 6202303 |
Method for producing high efficiency heat sinks |
— |
2001-03-20 |
| 5603619 |
Scalable test interface port |
Leonard O. Turner, Gerald A. Budelman |
1997-02-18 |
| 5594356 |
Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components |
Leonard O. Turner, Ashok N. Kabadi, Ron Flamm |
1997-01-14 |
| 5418469 |
Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components |
Leonard O. Turner, Ashok N. Kabadi, Ron Flamm |
1995-05-23 |
| 4993958 |
High density planar interconnect |
Douglas W. Trobough |
1991-02-19 |