Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7729121 | Removable package underside device attach | Anand Deshpande, Venkat Natarajan, Vittal Kini | 2010-06-01 |
| 7177142 | Hybrid compression socket connector for integrated circuits | Frank R. Deweese | 2007-02-13 |
| 6529385 | Component array adapter | Gary Brady, Harry L. Hampton, III, Michael White | 2003-03-04 |
| 6269864 | Parallel-plate/pin-fin hybrid copper heat sink for cooling high-powered microprocessors | — | 2001-08-07 |
| 6097609 | Direct BGA socket | — | 2000-08-01 |
| 5594356 | Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components | Leonard O. Turner, Mark B. Trobough, Ron Flamm | 1997-01-14 |
| 5418469 | Interconnection device for connecting test equipment with a circuit board designed for fine pitch solder lead integrated circuit components | Leonard O. Turner, Mark B. Trobough, Ron Flamm | 1995-05-23 |
| 5057023 | High density connector system | Leonard O. Turner, Ronald C. Flamm | 1991-10-15 |
| 4917613 | High density connection system | — | 1990-04-17 |
| 4850883 | High density flexible circuit connector | — | 1989-07-25 |
| 4798918 | High density flexible circuit | Leonard O. Turner, Michael White | 1989-01-17 |