| 12494443 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Prithwish Chatterjee, Andrew J. Brown |
2025-12-09 |
|
| 12489032 |
Cooling of conformal power delivery structures |
Feras Eid, Aleksandar Aleksov, Adel A. Elsherbini, Thomas L. Sounart, Johanna M. Swan |
2025-12-02 |
|
| 12487420 |
Apparatus and method of manufacturing a vertically disaggregated photonic device |
Adel A. Elsherbini |
2025-12-02 |
|
| 12255158 |
Components for millimeter-wave communication |
Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Diego Correas-Serrano |
2025-03-18 |
|
| 12255225 |
Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes |
Thomas L. Sounart, Kaan Oguz, Neelam Prabhu Gaunkar, Aleksandar Aleksov, I-Cheng Tung |
2025-03-18 |
|
| 12242290 |
Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures |
Beomseok Choi, William J. Lambert, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini +3 more |
2025-03-04 |
|
| 12205902 |
High-density interconnects for integrated circuit packages |
Veronica Strong, Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff |
2025-01-21 |
|
| 12199067 |
Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same |
Adel A. Elsherbini, Javier Soto Gonzalez, Shawna M. Liff |
2025-01-14 |
|
| 12176323 |
Microelectronic assemblies |
Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more |
2024-12-24 |
$17,261,000 |
| 12170244 |
High-throughput additively manufactured power delivery vias and traces |
Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, William J. Lambert +3 more |
2024-12-17 |
$33,648,000 |
| 12166261 |
Components for millimeter-wave communication |
Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-12-10 |
$13,394,000 |
| 12150271 |
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device |
Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Adel A. Elsherbini, Aleksandar Aleksov +1 more |
2024-11-19 |
$25,575,000 |
| 12126067 |
Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material |
Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-10-22 |
$18,859,000 |
| 12126068 |
Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials |
Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-10-22 |
$18,859,000 |
| 12113026 |
Multi-chip package and method of providing die-to-die interconnects in same |
Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2024-10-08 |
$19,971,000 |
| 12107314 |
Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad |
Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Diego Correas-Serrano |
2024-10-01 |
$20,560,000 |
| 12088360 |
Dispersive waveguide crosstalk mitigation |
Georgios Dogiamis, Diego Correas-Serrano, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Cooper S. Levy +2 more |
2024-09-10 |
$16,964,000 |
| 12087682 |
Power delivery structures |
Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, William J. Lambert +2 more |
2024-09-10 |
$16,964,000 |
| 12021289 |
Components for millimeter-wave communication |
Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-06-25 |
$22,163,000 |
| 11955684 |
Components for millimeter-wave communication |
Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-04-09 |
$27,197,000 |
| 11916604 |
Dispersion compensation for electromagnetic waveguides |
Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Thomas W. Brown +1 more |
2024-02-27 |
$28,450,000 |
| 11881457 |
Semiconductor packaging with high density interconnects |
Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Krishna Bharath, Javier Soto Gonzalez +1 more |
2024-01-23 |
|
| 11876053 |
Multi-chip package and method of providing die-to-die interconnects in same |
Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2024-01-16 |
$42,805,000 |
| 11824008 |
Multi-chip package and method of providing die-to-die interconnects in same |
Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2023-11-21 |
$28,968,000 |
| 11804455 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Prithwish Chatterjee, Andrew J. Brown |
2023-10-31 |
$30,374,000 |
