Issued Patents All Time
Showing 25 most recent of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255225 | Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes | Thomas L. Sounart, Kaan Oguz, Neelam Prabhu Gaunkar, Aleksandar Aleksov, I-Cheng Tung | 2025-03-18 |
| 12255158 | Components for millimeter-wave communication | Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Diego Correas-Serrano | 2025-03-18 |
| 12242290 | Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures | Beomseok Choi, William J. Lambert, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini +3 more | 2025-03-04 |
| 12205902 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2025-01-21 |
| 12199067 | Scalable embedded silicon bridge via pillars in lithographically defined vias, and methods of making same | Adel A. Elsherbini, Javier Soto Gonzalez, Shawna M. Liff | 2025-01-14 |
| 12176323 | Microelectronic assemblies | Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more | 2024-12-24 |
| 12170244 | High-throughput additively manufactured power delivery vias and traces | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, William J. Lambert +3 more | 2024-12-17 |
| 12166261 | Components for millimeter-wave communication | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-12-10 |
| 12150271 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2024-11-19 |
| 12126068 | Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-10-22 |
| 12126067 | Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-10-22 |
| 12113026 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-10-08 |
| 12107314 | Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad | Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Diego Correas-Serrano | 2024-10-01 |
| 12088360 | Dispersive waveguide crosstalk mitigation | Georgios Dogiamis, Diego Correas-Serrano, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Cooper S. Levy +2 more | 2024-09-10 |
| 12087682 | Power delivery structures | Adel A. Elsherbini, Feras Eid, Georgios Dogiamis, Beomseok Choi, William J. Lambert +2 more | 2024-09-10 |
| 12021289 | Components for millimeter-wave communication | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-06-25 |
| 11955684 | Components for millimeter-wave communication | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-04-09 |
| 11916604 | Dispersion compensation for electromagnetic waveguides | Diego Correas-Serrano, Georgios Dogiamis, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Thomas W. Brown +1 more | 2024-02-27 |
| 11881457 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Krishna Bharath, Javier Soto Gonzalez +1 more | 2024-01-23 |
| 11876053 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2024-01-16 |
| 11824008 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2023-11-21 |
| 11804455 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Prithwish Chatterjee, Andrew J. Brown | 2023-10-31 |
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2023-10-17 |
| 11764452 | Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity | Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing, Johanna M. Swan | 2023-09-19 |
| 11756948 | In situ package integrated thin film capacitors for power delivery | Thomas L. Sounart, Aleksandar Aleksov | 2023-09-12 |