Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Components for millimeter-wave communication

Components for millimeter-wave communication

US Patent 11955684 · Granted Apr 9, 2024

Estimated economic value: $27,197,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Packaging architecture with intermediate routing layers2025
Substrate integrated thin film capacitors using amorphous high-k dielectrics2025
Apparatus and method of manufacturing a vertically disaggregated photonic device2025
Cooling of conformal power delivery structures2025
Contactless communication using a waveguide extending through a substrate core2025
Contactless communication using a waveguide extending through a substrate core2025
Contactless communication using a waveguide extending through a substrate core2025
Inductor and transformer semiconductor devices using hybrid bonding technology2025
High precision scalable packaging architecture based on radio frequency scanning2025
Packaging architectures for sub-terahertz radio frequency devices2025
Physical vapor deposition seeding for high aspect ratio vias in glass core techn2025