Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Inductor and transformer semiconductor devices using hybrid bonding technology

Inductor and transformer semiconductor devices using hybrid bonding technology

US Patent 12469630 · Granted Nov 11, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Apparatus and method of manufacturing a vertically disaggregated photonic device2025
Validating and providing proactively generated code completion suggestions for c2025
Cooling of conformal power delivery structures2025
Contactless communication using a waveguide extending through a substrate core2025
Fine-grained disaggregated server architecture2025
High precision scalable packaging architecture based on radio frequency scanning2025
Packaging architectures for sub-terahertz radio frequency devices2025
Packaging architectures for sub-terahertz radio frequency devices2025