Issued Patents All Time
Showing 25 most recent of 261 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431430 | Technologies for high throughput additive manufacturing for integrated circuit components | Yoshihiro Tomita, Aleksandar Aleksov, Feras Eid, Wenhao Li, Stephen L. Morein | 2025-09-30 |
| 12424543 | Selective interconnects in back-end-of-line metallization stacks of integrated circuitry | Shawna M. Liff, Johanna M. Swan | 2025-09-23 |
| 12424589 | Contiguous shield structures in microelectronic assemblies having hybrid bonding | Beomseok Choi, Han Wui Then, Johanna M. Swan, Shawna M. Liff | 2025-09-23 |
| 12417978 | Microelectronic assemblies having backside die-to-package interconnects | Kimin Jun, Shawna M. Liff, Johanna M. Swan, Han Wui Then | 2025-09-16 |
| 12412881 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar | 2025-09-09 |
| 12406962 | Power delivery through capacitor-dies in a multi-layered microelectronic assembly | William J. Lambert, Krishna Bharath, Shawna M. Liff, Nicolas Butzen, Georgios Dogiamis +4 more | 2025-09-02 |
| 12381182 | Direct bonding in microelectronic assemblies | Feras Eid, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan | 2025-08-05 |
| 12362297 | Semiconductor packages with antennas | Telesphor Kamgaing, Sasha N. Oster | 2025-07-15 |
| 12362284 | Composite interposer structure and method of providing same | Shawna M. Liff, Johanna M. Swan, Gerald Pasdast | 2025-07-15 |
| 12341114 | Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling | Georgios Dogiamis, Qiang Yu, Shawna M. Liff | 2025-06-24 |
| 12327827 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar | 2025-06-10 |
| 12327775 | Thermal performance in hybrid bonded 3D die stacks | Feras Eid, Johanna M. Swan, Shawna M. Liff, Aleksandar Aleksov, Julien Sebot | 2025-06-10 |
| 12315840 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2025-05-27 |
| 12315794 | Skip level vias in metallization layers for integrated circuit devices | Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Gerald Pasdast, Sathya Narasimman Tiagaraj | 2025-05-27 |
| 12308362 | Packaging architecture for disaggregated integrated voltage regulators | Kaladhar Radhakrishnan, Krishna Bharath, William J. Lambert, Sriram Srinivasan, Christopher Schaef | 2025-05-20 |
| 12300579 | Liquid cooled interposer for integrated circuit stack | Georgios Dogiamis, Qiang Yu, Feras Eid, Kimin Jun, Johanna M. Swan +1 more | 2025-05-13 |
| 12300666 | Microelectronic assemblies with communication networks | Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan | 2025-05-13 |
| 12300626 | Microelectronic assemblies | Shawna M. Liff, Johanna M. Swan | 2025-05-13 |
| 12288750 | Conformal power delivery structure for direct chip attach architectures | William J. Lambert, Beomseok Choi, Krishna Bharath, Kaladhar Radhakrishnan | 2025-04-29 |
| 12288746 | Skip level vias in metallization layers for integrated circuit devices | Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Gerald Pasdast, Sathya Narasimman Tiagaraj | 2025-04-29 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Kimin Jun, Shawna M. Liff +3 more | 2025-04-01 |
| 12266840 | Waveguide interconnects for semiconductor packages and related methods | Georgios Dogiamis, Johanna M. Swan, Shawna M. Liff, Beomseok Choi, Qiang Yu | 2025-04-01 |
| 12242290 | Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures | Beomseok Choi, William J. Lambert, Krishna Bharath, Kaladhar Radhakrishnan, Henning Braunisch +3 more | 2025-03-04 |
| 12224261 | Mixed hybrid bonding structures and methods of forming the same | Shawna M. Liff, Johanna M. Swan, Nagatoshi Tsunoda, Jimin Yao | 2025-02-11 |
| 12218069 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati | 2025-02-04 |