| 12500207 |
Packaging architecture with intermediate routing layers |
Kimin Jun, Christopher M. Pelto, Georgios Dogiamis, Bradley A. Jackson, Shawna M. Liff +1 more |
2025-12-16 |
|
| 12500177 |
Microelectronic assemblies with communication networks |
Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan |
2025-12-16 |
|
| 12487420 |
Apparatus and method of manufacturing a vertically disaggregated photonic device |
Henning Braunisch |
2025-12-02 |
|
| 12489032 |
Cooling of conformal power delivery structures |
Feras Eid, Aleksandar Aleksov, Henning Braunisch, Thomas L. Sounart, Johanna M. Swan |
2025-12-02 |
|
| 12469630 |
Inductor and transformer semiconductor devices using hybrid bonding technology |
Georgios Dogiamis, Qiang Yu, Kimin Jun |
2025-11-11 |
|
| 12469820 |
Fine-grained disaggregated server architecture |
Carleton L. Molnar, Tanay Karnik, Shawna M. Liff, Robert J. Munoz, Julien Sebot +6 more |
2025-11-11 |
|
| 12463156 |
Packaging architectures for sub-terahertz radio frequency devices |
Georgios Dogiamis |
2025-11-04 |
|
| 12456702 |
Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets |
Kimin Jun, Feras Eid, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +1 more |
2025-10-28 |
|
| 12438087 |
High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries |
Aleksandar Aleksov, Feras Eid, Weiyi Li, Stephen L. Morein, Yoshihiro Tomita |
2025-10-07 |
|
| 12431430 |
Technologies for high throughput additive manufacturing for integrated circuit components |
Yoshihiro Tomita, Aleksandar Aleksov, Feras Eid, Wenhao Li, Stephen L. Morein |
2025-09-30 |
|
| 12424589 |
Contiguous shield structures in microelectronic assemblies having hybrid bonding |
Beomseok Choi, Han Wui Then, Johanna M. Swan, Shawna M. Liff |
2025-09-23 |
|
| 12424543 |
Selective interconnects in back-end-of-line metallization stacks of integrated circuitry |
Shawna M. Liff, Johanna M. Swan |
2025-09-23 |
|
| 12417978 |
Microelectronic assemblies having backside die-to-package interconnects |
Kimin Jun, Shawna M. Liff, Johanna M. Swan, Han Wui Then |
2025-09-16 |
|
| 12412881 |
Microelectronic assemblies |
Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar |
2025-09-09 |
|
| 12406962 |
Power delivery through capacitor-dies in a multi-layered microelectronic assembly |
William J. Lambert, Krishna Bharath, Shawna M. Liff, Nicolas Butzen, Georgios Dogiamis +4 more |
2025-09-02 |
|
| 12381182 |
Direct bonding in microelectronic assemblies |
Feras Eid, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan |
2025-08-05 |
|
| 12362297 |
Semiconductor packages with antennas |
Telesphor Kamgaing, Sasha N. Oster |
2025-07-15 |
|
| 12362284 |
Composite interposer structure and method of providing same |
Shawna M. Liff, Johanna M. Swan, Gerald Pasdast |
2025-07-15 |
|
| 12341114 |
Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling |
Georgios Dogiamis, Qiang Yu, Shawna M. Liff |
2025-06-24 |
|
| 12327827 |
Microelectronic assemblies |
Shawna M. Liff, Johanna M. Swan, Arun Chandrasekhar |
2025-06-10 |
|
| 12327775 |
Thermal performance in hybrid bonded 3D die stacks |
Feras Eid, Johanna M. Swan, Shawna M. Liff, Aleksandar Aleksov, Julien Sebot |
2025-06-10 |
|
| 12315840 |
Microelectronic assemblies |
Shawna M. Liff, Johanna M. Swan |
2025-05-27 |
|
| 12315794 |
Skip level vias in metallization layers for integrated circuit devices |
Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Gerald Pasdast, Sathya Narasimman Tiagaraj |
2025-05-27 |
|
| 12308362 |
Packaging architecture for disaggregated integrated voltage regulators |
Kaladhar Radhakrishnan, Krishna Bharath, William J. Lambert, Sriram Srinivasan, Christopher Schaef |
2025-05-20 |
|
| 12300666 |
Microelectronic assemblies with communication networks |
Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan |
2025-05-13 |
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