Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling

Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling

US Patent 12341114 · Granted Jun 24, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Microelectronic assemblies with communication networks2025
Microelectronic assemblies with communication networks2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Packaging architecture with intermediate routing layers2025
Apparatus and method of manufacturing a vertically disaggregated photonic device2025
Cooling of conformal power delivery structures2025
Contactless communication using a waveguide extending through a substrate core2025
Ultra-thin, hyper-density semiconductor packages2025
Inductor and transformer semiconductor devices using hybrid bonding technology2025
Inductor and transformer semiconductor devices using hybrid bonding technology2025
Fine-grained disaggregated server architecture2025