| 12500207 |
Packaging architecture with intermediate routing layers |
Kimin Jun, Adel A. Elsherbini, Christopher M. Pelto, Bradley A. Jackson, Shawna M. Liff +1 more |
2025-12-16 |
|
| 12489189 |
Contactless communication using a waveguide extending through a substrate core |
Telesphor Kamgaing, Neelam Prabhu Gaunkar, Johanna M. Swan |
2025-12-02 |
|
| 12469630 |
Inductor and transformer semiconductor devices using hybrid bonding technology |
Qiang Yu, Adel A. Elsherbini, Kimin Jun |
2025-11-11 |
|
| 12469954 |
High precision scalable packaging architecture based on radio frequency scanning |
Alon Cohen, Ophir Shabtay |
2025-11-11 |
|
| 12463156 |
Packaging architectures for sub-terahertz radio frequency devices |
Adel A. Elsherbini |
2025-11-04 |
|
| 12444619 |
Physical vapor deposition seeding for high aspect ratio vias in glass core technology |
Veronica Strong, Aleksandar Aleksov, Telesphor Kamgaing, Neelam Prabhu Gaunkar |
2025-10-14 |
|
| 12424719 |
Compact surface transmission line waveguides with vertical ground planes |
Telesphor Kamgaing, Neelam Prabhu Gaunkar, Veronica Strong, Aleksandar Aleksov |
2025-09-23 |
|
| 12424716 |
RF filters and multiplexers manufactured in the core of a package substrate using glass core technology |
Aleksandar Aleksov, Neelam Prabhu Gaunkar, Veronica Strong, Telesphor Kamgaing |
2025-09-23 |
|
| 12424563 |
Disaggregated entropy services for microelectronic assemblies |
Rachael Parker, David Johnston |
2025-09-23 |
|
| 12406962 |
Power delivery through capacitor-dies in a multi-layered microelectronic assembly |
Adel A. Elsherbini, William J. Lambert, Krishna Bharath, Shawna M. Liff, Nicolas Butzen +4 more |
2025-09-02 |
|
| 12368091 |
Package substrate with glass core having vertical power planes for improved power delivery |
Aleksandar Aleksov, Telesphor Kamgaing, Veronica Strong, Neelam Prabhu Gaunkar |
2025-07-22 |
|
| 12347761 |
Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate |
Aleksandar Aleksov, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Veronica Strong, Johanna M. Swan |
2025-07-01 |
|
| 12341114 |
Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling |
Qiang Yu, Adel A. Elsherbini, Shawna M. Liff |
2025-06-24 |
|
| 12327795 |
Waveguide interconnect bridges |
Johanna M. Swan |
2025-06-10 |
|
| 12300579 |
Liquid cooled interposer for integrated circuit stack |
Qiang Yu, Feras Eid, Adel A. Elsherbini, Kimin Jun, Johanna M. Swan +1 more |
2025-05-13 |
|
| 12266840 |
Waveguide interconnects for semiconductor packages and related methods |
Johanna M. Swan, Adel A. Elsherbini, Shawna M. Liff, Beomseok Choi, Qiang Yu |
2025-04-01 |
|
| 12261097 |
Thermal management in integrated circuit packages |
Feras Eid, Telesphor Kamgaing, Aleksandar Aleksov, Johanna M. Swan |
2025-03-25 |
|
| 12255158 |
Components for millimeter-wave communication |
Neelam Prabhu Gaunkar, Telesphor Kamgaing, Diego Correas-Serrano, Henning Braunisch |
2025-03-18 |
|
| 12199012 |
Modular microchannel thermal solutions for integrated circuit devices |
Adel A. Elsherbini, Stephen L. Morein, Feras Eid |
2025-01-14 |
|
| 12183961 |
Methods for conductively coating millimeter waveguides |
Aleksandar Aleksov, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff +3 more |
2024-12-31 |
$16,542,000 |
| 12170244 |
High-throughput additively manufactured power delivery vias and traces |
Adel A. Elsherbini, Feras Eid, Henning Braunisch, Beomseok Choi, William J. Lambert +3 more |
2024-12-17 |
$33,648,000 |
| 12166261 |
Components for millimeter-wave communication |
Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing |
2024-12-10 |
$13,394,000 |
| 12155372 |
Multi-filter die |
Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan |
2024-11-26 |
$26,820,000 |
| 12155133 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems |
Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Aleksandar Aleksov |
2024-11-26 |
$26,820,000 |
| 12150271 |
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device |
Telesphor Kamgaing, Johanna M. Swan, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more |
2024-11-19 |
$25,575,000 |
