Issued Patents All Time
Showing 25 most recent of 149 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424563 | Disaggregated entropy services for microelectronic assemblies | Rachael Parker, David Johnston | 2025-09-23 |
| 12424719 | Compact surface transmission line waveguides with vertical ground planes | Telesphor Kamgaing, Neelam Prabhu Gaunkar, Veronica Strong, Aleksandar Aleksov | 2025-09-23 |
| 12424716 | RF filters and multiplexers manufactured in the core of a package substrate using glass core technology | Aleksandar Aleksov, Neelam Prabhu Gaunkar, Veronica Strong, Telesphor Kamgaing | 2025-09-23 |
| 12406962 | Power delivery through capacitor-dies in a multi-layered microelectronic assembly | Adel A. Elsherbini, William J. Lambert, Krishna Bharath, Shawna M. Liff, Nicolas Butzen +4 more | 2025-09-02 |
| 12368091 | Package substrate with glass core having vertical power planes for improved power delivery | Aleksandar Aleksov, Telesphor Kamgaing, Veronica Strong, Neelam Prabhu Gaunkar | 2025-07-22 |
| 12347761 | Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate | Aleksandar Aleksov, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Veronica Strong, Johanna M. Swan | 2025-07-01 |
| 12341114 | Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling | Qiang Yu, Adel A. Elsherbini, Shawna M. Liff | 2025-06-24 |
| 12327795 | Waveguide interconnect bridges | Johanna M. Swan | 2025-06-10 |
| 12300579 | Liquid cooled interposer for integrated circuit stack | Qiang Yu, Feras Eid, Adel A. Elsherbini, Kimin Jun, Johanna M. Swan +1 more | 2025-05-13 |
| 12266840 | Waveguide interconnects for semiconductor packages and related methods | Johanna M. Swan, Adel A. Elsherbini, Shawna M. Liff, Beomseok Choi, Qiang Yu | 2025-04-01 |
| 12261097 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Aleksandar Aleksov, Johanna M. Swan | 2025-03-25 |
| 12255158 | Components for millimeter-wave communication | Neelam Prabhu Gaunkar, Telesphor Kamgaing, Diego Correas-Serrano, Henning Braunisch | 2025-03-18 |
| 12199012 | Modular microchannel thermal solutions for integrated circuit devices | Adel A. Elsherbini, Stephen L. Morein, Feras Eid | 2025-01-14 |
| 12183961 | Methods for conductively coating millimeter waveguides | Aleksandar Aleksov, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff +3 more | 2024-12-31 |
| 12170244 | High-throughput additively manufactured power delivery vias and traces | Adel A. Elsherbini, Feras Eid, Henning Braunisch, Beomseok Choi, William J. Lambert +3 more | 2024-12-17 |
| 12166261 | Components for millimeter-wave communication | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-12-10 |
| 12155133 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Aleksandar Aleksov | 2024-11-26 |
| 12155372 | Multi-filter die | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2024-11-26 |
| 12150271 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2024-11-19 |
| 12126068 | Millimeter-wave dielectric waveguide bundle including first and second adjacent dielectric waveguides having different core and/or cladding materials | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-10-22 |
| 12126067 | Millimeter-wave dielectric waveguide including an opening of varying cross-section enclosed within a first material and the first material surrounded by a second material | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-10-22 |
| 12107314 | Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad | Neelam Prabhu Gaunkar, Telesphor Kamgaing, Henning Braunisch, Diego Correas-Serrano | 2024-10-01 |
| 12088360 | Dispersive waveguide crosstalk mitigation | Henning Braunisch, Diego Correas-Serrano, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Cooper S. Levy +2 more | 2024-09-10 |
| 12087682 | Power delivery structures | Adel A. Elsherbini, Feras Eid, Beomseok Choi, Henning Braunisch, William J. Lambert +2 more | 2024-09-10 |
| 12040776 | Integrated radio frequency (RF) front-end module (FEM) | Telesphor Kamgaing, Aleksandar Aleksov, Feras Eid, Johanna M. Swan | 2024-07-16 |