Issued Patents All Time
Showing 26–50 of 149 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040307 | Magnetic induced heating for solder interconnects | Feras Eid, Adel A. Elsherbini | 2024-07-16 |
| 12021289 | Components for millimeter-wave communication | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-06-25 |
| 12007170 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Aleksandar Aleksov, Johanna M. Swan | 2024-06-11 |
| 11990419 | Physically unclonable function circuitry of a package substrate and method of providing same | Feras Eid, Adel A. Elsherbini, David Johnston, Jyothi Bhaskarr Velamala, Rachael Parker | 2024-05-21 |
| 11984439 | Microelectronic assemblies | Adel A. Elsherbini, Shawna M. Liff, Zhiguo Qian, Johanna M. Swan | 2024-05-14 |
| 11955684 | Components for millimeter-wave communication | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing | 2024-04-09 |
| 11916604 | Dispersion compensation for electromagnetic waveguides | Diego Correas-Serrano, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Thomas W. Brown +1 more | 2024-02-27 |
| 11895815 | Additive manufacturing for integrated circuit assembly cables | Adel A. Elsherbini, Feras Eid | 2024-02-06 |
| 11887944 | Additive manufacturing for integrated circuit assembly connectors | Feras Eid, Adel A. Elsherbini | 2024-01-30 |
| 11842826 | Additive manufacturing for integrated circuit assembly connector support structures | Adel A. Elsherbini, Feras Eid, Johanna M. Swan | 2023-12-12 |
| 11830787 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Aleksandar Aleksov, Johanna M. Swan | 2023-11-28 |
| 11830831 | Semiconductor package including a modular side radiating waveguide launcher | Sasha N. Oster, Johanna M. Swan, Shawna M. Liff, Adel A. Elsherbini, Telesphor Kamgaing +1 more | 2023-11-28 |
| 11784108 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Aleksandar Aleksov, Johanna M. Swan | 2023-10-10 |
| 11764452 | Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity | Adel A. Elsherbini, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan | 2023-09-19 |
| 11728290 | Waveguide fan-out | Adel A. Elsherbini, Johanna M. Swan, Aleksandar Aleksov, Telesphor Kamgaing, Henning Braunisch | 2023-08-15 |
| 11721650 | Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package | Brandon C. Marin, Aleksandar Aleksov, Jeremy Ecton, Suddhasattwa Nad, Mohammad Mamunur Rahman | 2023-08-08 |
| 11716826 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2023-08-01 |
| 11715693 | Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture | Aleksandar Aleksov, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan, Telesphor Kamgaing | 2023-08-01 |
| 11694962 | Microelectronic package with mold-integrated components | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2023-07-04 |
| 11688660 | Bridge for radio frequency (RF) multi-chip modules | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2023-06-27 |
| 11658418 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Aleksandar Aleksov | 2023-05-23 |
| 11652264 | Microelectronic assemblies with substrate integrated waveguide | Adel A. Elsherbini | 2023-05-16 |
| 11641711 | Microelectronic package with substrate-integrated components | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2023-05-02 |
| 11621192 | Inorganic dies with organic interconnect layers and related structures | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2023-04-04 |
| 11605603 | Microelectronic package with radio frequency (RF) chiplet | Adel A. Elsherbini, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan, Shawna M. Liff +1 more | 2023-03-14 |